ULVAC Technologies, Inc. (www.ulvac.com) has announced that their sister company, ULVAC TECHNO, Ltd. is offering U.S. and European-based vacuum companies a means of expanding their presence in Japan and East Asia (Korea, China, Taiwan).
Packaging
Imint and MediaTek To Bring Advanced Video Enhancement Technology to More Smartphones & Other Mobile Devices Worldwide
IMINT Image Intelligence AB (“Imint”), a global leader in video enhancement software, today announced its collaboration with Taiwanese fabless chipset company MediaTek to significantly advance the adoption of video enhancement technology in smartphones and other mobile devices by enabling the integration of Imint’s Vidhance software suite into new MediaTek’s chipsets.
Kaman KD-5600 Family of Digital Differential Measuring Systems Ideal for Wide Range of Applications, Industries
The Measuring Division of Kaman Precision Products, Inc., the world leader in the design and manufacture of high-performance position measurement systems, announces that the KD-5600 family of eddy current measurement systems is ideal for use in COTS applications for fast steering mirrors, magnetic bearing active control, shaft vibration, image stabilization, and adaptive optics.
Synopsys and GLOBALFOUNDRIES Collaborate to Expand Fusion Compiler Benefits for Latest Platforms
This collaboration will enable the fast-tracking of next-generation, market-shaping products in verticals such as aerospace and defense, automotive, data center, IoT and mobile on GF’s feature-rich platforms.
GLOBALFOUNDRIES Collaborates with Cadence on Availability of Mixed-Signal OpenAccess PDK for 22FDX Platform to Enable Advanced Mixed-Signal and mmWave Design
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration with GLOBALFOUNDRIES (GF) that resulted in the availability of a Mixed-Signal OpenAccess process design kit (PDK) that supports GF’s 22FDX platform.
Xilinx and Continental Collaborate to Create Auto Industry’s First Production-Ready 4D Imaging Radar for Autonomous Driving
Xilinx, Inc. and Continental today announced that Xilinx will power Continental’s new Advanced Radar Sensor (ARS) 540 with the Zynq UltraScale+ MPSoC platform, creating the automotive industry’s first production-ready 4D imaging radar.
KLA Announces Enhanced Portfolio of Systems for Advanced Packaging
KLA Corporation announced the launch of the Kronos 1190 wafer-level packaging inspection system, the ICOS F160XP die sorting and inspection system and the next generation of the ICOS T3/T7 Series of packaged integrated circuit (IC) component inspection and metrology systems.
Scintil Photonics Appoints Soitec as Board Observer
Scintil Photonics, a developer of silicon photonic fully integrated circuits including laser integration, today announces the appointment of Ionut Radu, director of R&D at Soitec, as an observer on Scintil’s board of directors.
SEMI-NBMC Invites White Paper Proposals for Funding of Human Monitoring Innovations
SEMI Nano-Bio Materials Consortium (NBMC) today released a Request for Proposals (RFP) for innovations in ambulatory monitoring, wearable technologies for cognitive assessment, and innovative power sources for wearable monitors.
Like-Minded Nations Can Advance Their Leadership in Semiconductors Through International Collaboration, Says New ITIF Report
The semiconductor sector constitutes one of today’s most important industries, providing the core technology that powers the modern digital world. Yet countries seeking self-sufficiency in this space threaten their own competitiveness, as succeeding entirely independently is almost impossible in such a complex sector, argues a new report released today by the Information Technology and Innovation Foundation.
