This tapeout is the culmination of an extensive collaboration between Synopsys and Samsung Foundry to accelerate the delivery of a highly optimized reference methodology that realizes the maximum power and performance opportunities inherent to the latest 3D transistor architecture.
Packaging
Novel Heat-Management Material Keeps Computers Running Cool
UCLA engineers have demonstrated successful integration of a novel semiconductor material into high-power computer chips to reduce heat on processors and improve their performance.
Rigetti Computing Introduces World’s First Scalable Multi-Chip Quantum Processor
Rigetti Computing, a pioneer in full-stack quantum computing, announced today it is launching the world’s first multi-chip quantum processor.
SIA Calls for House Passage of Legislation to Advance U.S. Technology Leadership
The National Science Foundation for the Future Act (H.R. 2225) and the Department of Energy Science for the Future Act (H.R. 3593) would help maintain and build on U.S. science and technology leadership.
Park Systems Announces Park FX40, the Autonomous AFM with Built-in Intelligence
Park Systems, the fastest growing manufacturer of Atomic Force Microscopes (AFM) just announced Park FX40, a groundbreaking autonomous atomic force microscope, infused with innovative robotics, intelligent learning features, safety features, software and specialized add-ons.
Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets
Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets.
A More Robust Memory Device for AI Systems
A research team from Northwestern Engineering and the University of Messina in Italy have developed a new magnetic memory device that could lead to faster, more robust Artificial Intelligence (AI) systems.
New Lattice CertusPro-NX General Purpose FPGAs Deliver Advanced System Bandwidth and Memory Capabilities to Edge Applications
Lattice Semiconductor Corporation today launched the Lattice CertusPro-NX general purpose FPGA family.
Cyient Celebrates First Anniversary of IC Design and Development Center in Duisburg, Germany
AnSem, a Cyient company, announced the first anniversary of the acquisition of an integrated circuit (IC) design center in Duisburg, Germany.
Nordson Electronics Solutions Ships First SELECT Unit from New Global Manufacturing Facility
The relocation expands operations and capabilities for SELECT’s selective soldering systems used in electronics manufacturing.
