imec, together with Sivers Photonics and ASM AMICRA Microtechnologies, announced the successful wafer-scale integration of indium-phosphide (InP) distributed feedback (DFB) lasers from Sivers’ InP100 platform onto imec’s silicon photonics platform (iSiPP).
Packaging
Intel 144-Tier Three-deck FG NAND with 161 Total Gates
A new 3D QLC NAND product has just arrived. TechInsights has quickly reviewed the Intel 1Tb QLC die removed from SSD 670p series which use 144L 3D NAND devices.
Synopsys Expands Multi-Die Solution Leadership with Industry’s Lowest Latency Die-to-Die Controller IP
Synopsys, Inc. today announced its new DesignWare Die-to-Die Controller IP, which complements the company’s existing 112G USR/XSR PHY IP for a complete die-to-die IP solution.
Dominant Factor of Carrier Transport Mechanism in Multilayer Graphene Nanoribbons Revealed
Researchers precisely set the number of layers in multilayer graphene nanoribbons, controlling the semiconducting and metallic properties of field effect transistors and establishing a design guideline for the practical applications of graphene devices.
NXP Announces Two Processors on TSMC 16nm FinFET Technology
NXP Semiconductors N.V. and TSMC today announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16nm FinFET process technology.
Micron Unveils 176-Layer NAND and 1-Alpha DRAM
Volume ramp of memory and storage portfolio additions power innovation across data center, intelligent vehicles and consumer devices.
First Quarter 2021 Global Semiconductor Equipment Billings Increase 51% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings increased 51% year-over-year and 21% from the prior quarter to US$23.6 billion, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
TSMC Unveils Innovations at 2021 Online Technology Symposium
TSMC is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium.
A*STAR’s Institute of Microelectronics and NexGen Announce New Wafer Applications Joint Laboratory in Singapore
A*STAR’s Institute of Microelectronics (IME) and NexGen Wafer Systems (NexGen) have established a S$9 million wafer applications joint laboratory to develop chemical wet etching and wafer substrate thinning processes for semiconductor IC fabrication and 3D wafer level packaging technology.
Microchip Further Protects FPGA-based Designs with First Tool that Combats Major Industry Threat to System Security in the Field
Mission-critical and other high-assurance systems deployed worldwide are under rapidly evolving threats from cybercriminals who attempt to extract Critical Program Information (CPI) via the FPGAs that power them.
