Samsung Electronics Co. today introduced the LM301B EVO, a new mid-power LED package that has been designed to set the pace in light efficacy and color quality for indoor and industrial applications.
Packaging
Renesas Expands Portfolio of World’s Smallest Photocouplers for Industrial Automation and Solar Inverter Applications
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today expanded its family of 8.2mm creepage photocouplers with three new devices designed for operation in harsh industrial automation equipment, solar inverter, and EV charger operating environments.
OmniVision Announces 0.61µm pixel, High Resolution 4K Image Sensor
OmniVision Technologies, Inc., a developer of advanced digital imaging solutions, today announced the OV60A―the world’s first 0.61 micron (µm) pixel high resolution CMOS image sensor that will revolutionize the capabilities of next-generation mobile phone cameras.
Global Organic CMOS Image Sensor Market is Expected to Grow at a CAGR of 12.2% from 2017 to 2028
The global Organic CMOS Image Sensor Market was valued at USD 1,086.7 million in 2020 and is projected to register a CAGR of 12.2% to reach USD 2,723.8 million by 2028 in the COVID-19 period.
Top-15 Semi Companies Log Year-Over-Year Growth of 21% in 1Q21
Excluding Intel, the group would have shown a 29% jump in 1Q21/1Q20 sales.
AI Chipmaker Hailo Awarded Edge AI and Vision Product of the Year
The Hailo-8, the AI processor for edge devices from AI (Artificial Intelligence) chipmaker Hailo, has been selected as winner of the 2021 Edge AI and Vision Product of the Year Awards for “Best Edge AI processor.”
Synopsys Digital and Custom Design Platforms Certified for TSMC’s Latest 3nm Process Technology
Synopsys, Inc. today announced that TSMC has certified Synopsys’ digital and custom design solutions based on TSMC’s latest design-rule manual (DRM) and process design kits for its advanced 3-nanometer (nm) process technology.
Global 200mm Fab Capacity on Pace to Record Growth to Meet Surging Demand and Address Chip Shortage
Semiconductor manufacturers worldwide are on track to boost 200mm fab capacity by 950,000 wafers, or 17%, from 2020 through 2024 to reach a record high of 6.6 million wafers per month, SEMI announced today.
Meghan Biery Joins Semiconductor Industry Association as Director of Global Technology and Security Policy
Biery most recently served as senior national security policy advisor at the Commerce Department’s Bureau of Industry and Security.
Kurt Sievers, President and CEO of NXP Semiconductors, Joins GSA’s Board of Directors
The Global Semiconductor Alliance (GSA) Board of Directors welcomes Kurt Sievers, President and CEO of NXP Semiconductors (NXP).
