STMicroelectronics has released the first reference design for its MasterGaN power packages, demonstrating how the new highly integrated devices increase power density, boost energy efficiency, simplify design, and accelerate time to market.
Packaging
Intel and QuTech Demonstrate Advances in Solving Quantum Interconnect Bottlenecks
New research published in Nature highlights progress toward quantum scalability with high-fidelity control and programmability of silicon qubits using the Horse Ridge cryogenic controller.
AIM Photonics Announces Appointment of Tod A. Laursen as Chair of Leadership Council
The American Institute for Manufacturing Integrated Photonics (AIM Photonics) today announced the appointment of Dr. Tod A. Laursen, as Chair of the AIM Photonics Leadership Council, which focuses on the strategic and technical direction of the Institute.
Researchers Develop Magnetic Thin Film for Spin-Thermoelectric Energy Conversion
A team of researchers, affiliated with UNIST has recently introduced a new class of magnetic materials for spin caloritronics.
Samsung Unveils Industry-First Memory Module Incorporating New CXL Interconnect Standard
Samsung Electronics Co., Ltd. today unveiled the industry’s first memory module supporting the new Compute Express Link (CXL) interconnect standard.
Veeco Announces Multi-System Lithography Order
Veeco Instruments Inc. (NASDAQ: VECO) today announced that a world leader in semiconductor assembly and testing has placed a multi-system order for its AP300 Lithography System for the production ramp of advanced packaging chips.
Worldwide Semiconductor Revenue Grew 10.8% in 2020 to $464 Billion, Growth Will Accelerate This Year Despite Market Shortages, According to IDC
Despite the impact of COVID-19 on the global economy, the semiconductor market performed strongly in 2020. Demand by industry was uneven throughout the year due to global lockdowns, remote work and education, and shifts in consumer buying behavior.
JCET Completes RMB 5 Billion Private Placement with Diversified Investment Structure
JCET Group, a global provider of integrated circuit (IC) manufacturing and technology services, recently announced that the company successfully completed a capital raising of approximately RMB 5 billion.
Boston Semi Equipment Reports Record Backlog for Test Handlers
Boston Semi Equipment (BSE), a global semiconductor test automation and test handler company, today announced record orders for its test handlers.
SEMICON Europa, Messe München electronica 2022 Postponed One Week
SEMICON Europa 2022, co-located with electronica, will be postponed one week to November 15-18, SEMI announced today. The move follows Messe Munich’s announcement that it will postpone electronica for organizational reasons.
