Model N Inc. (NYSE: MODN) today announced a new partnership with Channelnomics, a business strategy and research firm that enables high technology companies to assess, plan, and build channel program success.
Packaging
PsiQuantum and GLOBALFOUNDRIES to Build the World’s First Full-scale Quantum Computer
PsiQuantum, a quantum computing company focused on delivering a 1 million-plus qubit quantum computer, and GLOBALFOUNDRIES (GF) today announced a major breakthrough in their partnership to build the world’s first full-scale commercial quantum computer.
Applied Materials Introduces Materials Engineering Solutions for DRAM Scaling
Applied Materials, Inc. today announced materials engineering solutions that give its memory customers three new ways to further scale DRAM and accelerate improvements in chip performance, power, area, cost and time to market (PPACt).
Gel-Pak Collaborates with BAE Systems on Packaging Solution for Thin Semiconductor Devices
Gel-Pak, a division of Delphon and a manufacturer of protective device carrier and film products for the semiconductor and optoelectronics industries announces its collaboration with BAE Systems on a new product called the Lid/Clip Super System (LCS2).
Akoustis Locks Process Flow for Second Wafer Level Package for XBAW Filters
Akoustis Technologies, Inc., an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today that it has locked the process flow for its second chip scale package (CSP).
GLOBALFOUNDRIES Moves Corporate Headquarters to its Most Advanced Semiconductor Manufacturing Facility in New York
GLOBALFOUNDRIES announced at an onsite event with Senate Majority Leader Chuck Schumer that it will relocate its headquarters to Malta, New York, the site of Fab 8, the company’s most advanced semiconductor manufacturing facility — as the company positions itself for growth, strengthens partnerships with customers and recruits new talent.
A Silver Lining for Extreme Electronics
Tomorrow’s cutting-edge technology will need electronics that can tolerate extreme conditions. That’s why a group of researchers led by Michigan State University’s Jason Nicholas is building stronger circuits today.
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of SiC MOS Devices
JEDEC Solid State Technology Association announces the publication of JEP184: Guideline for evaluating Bias Temperature Instability of Silicon Carbide Metal-Oxide-Semiconductor (MOS) Devices for Power Electronic Conversion.
SiFive and Samsung Foundry Extend Partnership to Accelerate AI SoC Development
The extended partnership will enable and accelerate the development of Artificial Intelligence and Machine Learning inference and training SoCs based on SiFive RISC-V processors and built using Samsung Foundry technology infrastructure.
Silicon Chip Will Drive Next Generation Communications
A new design of ultra-small silicon chip called a multiplexer will effectively manage terahertz waves which are key to the next generation of communications: 6G and beyond.
