Lattice Semiconductor Corporation today expanded its award-winning Lattice Crosslink-NX family with new FPGAs specified for automotive applications such as advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI) systems.
Packaging
Proteus Adds SnapEDA CAD Model Search to Boost Electronics Design Productivity
SnapEDA announced a new collaboration that places SnapEDA directly within Proteus’ printed circuit board (PCB) design environment.
Axcelis Announces Multiple Shipments of Purion High Energy Systems to Leading CMOS Image Sensor Manufacturers
Axcelis Technologies, Inc. announced today that it has shipped multiple Purion VXE high energy systems to leading CMOS image sensor manufacturers.
MaxLinear Appoints Tsu-Jae King Liu to Its Board of Directors
Dr. Liu has been appointed a Class I director with a term continuing until the 2022 annual meeting of stockholders, effective immediately.
Edwards Invests in New Facility for Cryogenic Pumps, Cryo-Chillers and Related Accessories
Edwards announces an investment in a new building in Haverhill, Massachusetts, expected to be completed during the second quarter 2022.
TSMC’s Technology Roadmap
Mark Liu, Chairman of Taiwan Semiconductor Manufacturing Company (TSMC), provided detailed insights into the company’s technology roadmap at the recent International Solid-State Circuits Conference (ISSCC). He waved off the suggestion that device technology improvements are slowing down.
SiFive and DARPA Collaborate to Bring the Power of RISC-V to Technology Innovation
SiFive, Inc., the provider of commercial RISC-V processor IP and custom silicon solutions, today announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation as part of the DARPA Toolbox Initiative.
CyberOptics to Share Technical Presentation About Airborne Particle Sensing Processes at PhotoMask Japan
CyberOptics Corporation will present a technical paper at PhotoMask Japan on April 20th at 6 p.m. CDT / April 21st at 8 a.m. JST.
Damage from Fire at Renesas Chip Factory Worse Than Initial Reports
Renesas Electronics Corporation today held a second press conference regarding the occurrence of a fire on March 19, 2021 at part of the processes in the N3 Building (300mm line) of Naka Factory (located in Hitachinaka, Ibaraki Prefecture).
Tortuga Logic and DARPA Extend Partnership Through the DARPA Toolbox Initiative
Tortuga Logic Inc. today announced a new licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs.
