Magnachip Semiconductor Corporation, the South Korean leader in display and power solutions, today announced that it has entered into a definitive agreement with South Dearborn Limited, a company incorporated in the Cayman Islands, and Michigan Merger Sub, Inc., a Delaware corporation, which are investment vehicles established by Wise Road Capital LTD and certain of its limited partners.
Packaging
SME Announces Geoffrey Boothroyd Outstanding Young Manufacturing Engineers
The 14 awardees, age 35 or younger, are being recognized for their exceptional contributions and accomplishments in manufacturing throughout the early stages of their careers.
TopLine Awarded US Patent for CCGA Lead Free Solder Columns
TopLine Corporation, a provider of electronic components, services, and component engineering technology, has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates.
Samsung Develops Industry’s First HKMG-Based DDR5 Memory; Ideal for Bandwidth-Intensive Advanced Computing Applications
Samsung Electronics Co. today announced that it has expanded its DDR5 DRAM memory portfolio with the industry’s first 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology.
Semiconductor Materials Supply-Chain Shortages
TECHCET CA LLC’s prediction of a wet chemical supply fallout is materializing.
CHIPS Alliance and RISC-V International Invite the RISC-V Community to Participate in Updating a New Unified Memory Architecture Standard
New joint working group will enhance the OmniXtend Cache Coherency architecture.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the March issue…
Intevac Announces MATRIX Order for Fan-Out Applications in the Advanced Semiconductor Packaging Market
Intevac, Inc. today announced an INTEVAC MATRIX PVD order for fan-out applications in the advanced semiconductor packaging market.
Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias Feature
Cadence Design Systems, Inc. today announced that it has collaborated with GLOBALFOUNDRIES to successfully tape out a Cadence Tensilica test chip on GF’s 22FDX platform.
Teledyne e2v HiRel Unveils Two New High-Power PIN Diode Limiter Modules
Limiter modules are designed for high reliability EW, radar applications. SCDs are supported, devices are tested and shipped from Teledyne’s certified US production facility
