Once the pandemic has passed, which changes in ordinary life are likely to endure? And how do memory IC manufacturers ensure that they are ready to meet the changed requirements of electronics device OEMs?
Packaging
Busch Vacuum Solutions Expands Service in Florida
Busch Vacuum Solutions USA, one of the largest manufacturers of vacuum pumps, blowers, compressors, and systems, announced today the opening of a new service facility in Tampa, Florida.
CEVA Appoints Jaclyn Liu to its Board of Directors; Bruce A. Mann Retires
CEVA, Inc., the licensor of wireless connectivity and smart sensing technologies, today announced that Jaclyn “Jackie” Liu has been appointed to its Board of Directors, as an independent member, effective February 16, 2021.
Kioxia and Western Digital Announce 6th-Generation 3D Flash Memory
Kioxia Corporation and Western Digital Corp. today announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology.
Illumipure Develops Air Guardian Enclosed Air Disinfection Chamber Using UV LED Technology to Disinfect >99% of Airborne Pathogens
Illumipure, a manufacturer of innovative LED lighting and disinfection systems for commercial and institutional applications, has developed an enclosed air disinfection chamber that eliminates >99% of airborne pathogens, including viruses, mold, and bacteria.
Broad Coalition of Tech, Medical, Auto, Other Business Leaders Urge President Biden to Fund Domestic Semiconductor Manufacturing, Research in Infrastructure Plan
The Semiconductor Industry Association (SIA), along with a broad coalition of 16 other tech, medical, auto, and other business groups, today in a letter urged President Biden to work with Congress to fully fund domestic semiconductor manufacturing and research provisions established in the recently enacted National Defense Authorization Act (NDAA).
ON Semiconductor Announces New 650V Silicon Carbide MOSFETs
ON Semiconductor has announced a new range of silicon carbide (SiC) MOSFET devices for demanding applications where power density, efficiency and reliability are key considerations.
Infinitesima Ships First RPM 3D System
Infinitesima Ltd announced the shipment of the first RPM 3D system to jointly develop 3-dimensional metrology applications for characterisation of semiconductor devices in collaboration with imec.
Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM.
SEMI Technology Unites Global Summit Opens with Executive Forum, Digital Transformation, Security and Sustainability in Spotlight
SEMI Technology Unites Global Summit opens today with keynotes on the power of technology to unite the world and insights on how the microelectronics industry can enable a secure and sustainable digital future.
