The Catholic University of Leuven, Technical University of Dresden and CEA-Leti have won the 2019 European SEMI Award at the SEMI Technology Unites Global Summit for their pivotal contributions in the fields of telecommunications and nanotechnology.
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Thermo Scientific Helios 5 PXL PFIB Wafer DualBeam Enables Inline Metrology of Advanced 3D Structures
Thermo Fisher Scientific, the world leader in serving science, today launched the Thermo Scientific Helios 5 PXL PFIB Wafer DualBeam. The system, a plasma focused ion beam scanning electron microscope, reduces time-to-data from days to hours for inline through-stack metrology and verification of high-aspect ratio structures.
A Performance Leap for Graphene Modulators In Next Generation Datacom and Telecom
Over the past years, global data traffic has experienced a boom, with over 12.5 billion connected devices all over the world. The current world-wide deployment of the 5G telecommunications standard is triggering the need for smaller devices with enhanced performances, such as higher speed, lower power consumption and reduced cost as well as easier manufacturability.
Court Dismisses ROHM Semiconductor USA’s Lawsuit for Declaratory Judgment of Noninfringement of MaxPower Semiconductor’s Patents and Compels Arbitration
MaxPower Semiconductor, Inc. (MaxPower), provider of high-performance power semiconductor products, today announced that, following a hearing on February 4, 2021, the U. S. District Court for the Northern District of California dismissed ROHM Semiconductor USA LLC (ROHM USA)’s complaint for declaratory judgment of noninfringement of MaxPower’s patents.
U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York
GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, today announced a strategic partnership with the U.S. Department of Defense (DoD) to provide a secure and reliable supply of semiconductor solutions manufactured at GF’s Fab 8 in Malta, New York.
Semiconductor Industry Leaders Urge President Biden to Prioritize Funding for Semiconductor Manufacturing, Research
The Semiconductor Industry Association (SIA) Board of Directors, comprised of CEOs and senior executives at leading U.S. chip companies, today sent a letter to President Biden urging him to include substantial funding for semiconductor manufacturing and research in the administration’s economic recovery and infrastructure plan.
Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54%
Foundries and memory IC suppliers maintain strongest capacity presence.
Kuprion Introduces ActiveCopper Filled Thermal Vias
Kuprion, Inc., a spinout of Lockheed Martin, introduced ActiveCopper™ Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex, advanced high performance systems.
Sensata Technologies Signs Definitive Agreement to Acquire Xirgo Technologies
Sensata Technologies (NYSE: ST), a leading industrial technology company and provider of sensor-rich solutions that…
CHIPS Alliance Brings on Rob Mains as New Executive Director
CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems,…
