A*STAR’s Institute of Microelectronics (IME) has partnered leading semiconductor companies to develop Chip-to-Wafer (C2W) Hybrid Bonding for high density 2.5D and 3D integrated circuit (IC) integration. The newly formed pre-competitive C2W Hybrid Bonding Consortium with international and local industry supply chain companies will leverage IME’s expertise in 2.5D and 3D IC integration and bonding technologies for the development of C2W hybrid bonding process and demonstration of 4 chips stacking with…
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USABC Awards $732,448 Battery Technology Assessment Program Contract to Nanoramic Laboratories
The United States Advanced Battery Consortium LLC (USABC), a subsidiary of the United States Council for Automotive Research LLC (USCAR), today announced the award of a $732,448 technology assessment program contract to Nanoramic Laboratories in Boston, Massachusetts to demonstrate Nanoramic’s high energy and power density lithium-ion battery based on polymer binder-free electrode technology in electric vehicle (EV) applications. The contract award, which includes a 50 percent cost share, funds a…
Mouser Stocks Industry’s Widest Selection of Products
Mouser Electronics, Inc. is the industry’s leading authorized New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components.
ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration
ASM PACIFIC TECHNOLOGY (ASM) and EV GROUP (EVG) announced the signing of a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications.
Renesas and Dialog Semiconductor to Join Forces to Advance Global Leadership in Embedded Solutions
Renesas Electronics Corporation and Dialog Semiconductor Plc announced they have reached an agreement on the terms of a recommended all-cash acquisition by Renesas of the entire issued and to be issued share capital of Dialog (the “Acquisition”) for EUR 67.50 per share, representing a total equity value of approximately EUR 4.9 billion (approximately 615.7 billion yen).
Total MPU Sales Surprise with Strong Gains in 2020, More Upside in 2021
IC Insights recently released its 2021 edition of The McClean Report. The new analysis and forecast of the IC industry includes an analysis and forecast of the total microprocessor (MPU) market, including computer CPUs for PCs, tablets, and servers, embedded MPUs, and cellphone application MPUs.
Top-10 IC Growth Categories Target Emerging Applications in 2021
Each of the top-10 growing IC product categories is expected to see a double-digit increase in sales, but only the top-five segments are forecast to grow faster than the total IC market, which IC Insights projects will rise 12% this year.
CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at SEMI Technology Unites Global Summit
CyberOptics Corporation will feature the WX3000 metrology and inspection system with Multi-Reflection Suppression™ (MRS) sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the Virtual SEMI Technology Unites Global Summit from February 15-19th.
Synopsys Demonstrates Silicon Proof of DesignWare 112G Ethernet PHY IP in 5nm Process for High-Performance Computing SoCs
Synopsys, Inc. today announced the silicon proof of DesignWare 112G Ethernet PHY IP in 5nm FinFET process, delivering significant performance, power and area advantages.
Top-10 IC Growth Categories Target Emerging Applications in 2021
IC Insights recently released its 2021 edition of The McClean Report. The new analysis and forecast of the IC industry includes IC Insights’ ranking of IC categories based on sales growth rate.
