Expanding its line of automotive grade die attach materials for advanced semiconductor packages, Henkel has developed and commercialized LOCTITE ABLESTIK ABP 8920TC.
Packaging
Semiconductor Equipment Consensus Forecast – Record Growth Ahead, SEMI Reports
Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase 16% compared to $59.6 billion in 2019 and register a new industry record of $68.9 billion in 2020.
High-Rate Li-ion Batteries Demonstrate Superior Safety
As the inevitable growth of transport electrification continues, the types of batteries that will be used in such vehicles, their charging parameters, infrastructure and timeframes are key considerations that will speed up the transition to electrification.
Mikrotron Launches its First FPGA-Driven Smart Cameras with the New EoSens Creation Series
Mikrotron is empowering machine vision engineers to achieve accelerated performance at a fraction of the cost of traditional customized solutions with its new EoSensCreation Series of FPGA programmable-ready smart cameras.
DENSO Adopts SDK SiC Epi-wafers for Next-Generation Booster Power Modules for FCEVs
Silicon carbide epitaxial wafers (SiC epi-wafers), the main material for power semiconductors, with a diameter of six inches (150mm) and manufactured by Showa Denko K.K., have been adopted by DENSO Corporation for their latest booster power modules for fuel cell electric vehicles (FCEVs).
Physics Discovery Leads to Ballistic Optical Materials
Electronics are increasingly being paired with optical systems, such as when accessing the internet on an electronically run computer through fiber optic cables.
KLA Introduces Two New Systems That Take On Semiconductor Manufacturing’s Toughest Problems
Today KLA Corporation (NASDAQ: KLAC) announced two new products: the PWG5 wafer geometry system and the Surfscan SP7XP wafer defect inspection system. The new systems are designed to address exceedingly difficult issues in the manufacture of leading-edge memory and logic integrated circuits.
Spin Memory Joins Semiconductor Industry Association as First MRAM-focused Member
Spin Memory, Inc. (Spin Memory), the leading developer of MRAM technologies, today announced that it is joining the Semiconductor Industry Association (SIA).
The 2021 Predictions in Power Electronics
As 2020 comes to a close, we will undoubtedly look back on the past twelve months as a time in which disruption was the hallmark. Amid the unprecedented socioeconomic upheaval brought about by Covid-19, organizations have had to pivot and strategize, adapt and change in new ways – in a far more agile manner than at any time in history.
Pfeiffer Vacuum Presents New Turbopumps HiPace 350 and HiPace 450
With the HiPace 350 and 450, Pfeiffer Vacuum presents a turbopump especially dedicated for applications like mass spectrometry, electron-microscopy, metrology tools, particle accelerators and plasma physics. In addition to analytical, vacuum-process and semiconductor technology, their broad range of applications also includes coating, research & development and industrial applications.
