Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, and 3db Access AG, a fabless semiconductor company specializing in secure ultra-wideband (UWB) low power chips, jointly announced that Renesas will license 3db UWB technology and will collaborate to bring best-in-class secure access solutions to the connected smart home, Internet of Things (IoT), Industry 4.0, mobile computing, and connected vehicle applications. The collaboration combines each company’s technical leadership in performance, size reduction, ultra-low power consumption, and security to deliver breakthrough multi-receiver UWB solutions to the global market.
Packaging
SEMI Industry Strategy Symposium Europe to Explore Tech’s Role in Meeting Region’s Most Pressing Needs
“ISS Europe is a powerful forum for identifying collaboration opportunities to strengthen Europe’s competitive advantage in the digital economy,” said Laith Altimime, president of SEMI Europe. “With the emergence of 5G, artificial intelligence (AI), augmented reality/virtual reality (AR/VR), quantum computing and other leading-edge technologies, the semiconductor industry is well-positioned to help drive the digital transformation for Europe’s societal and economic prosperity.”
David K. Lam to Unveil “Security Lithography” Advances to Thwart IC Counterfeiting at SPIE
Silicon Valley Hall of Famer and Founder of Lam Research to present unsurpassed levels of on-chip security enabled by Multicolumn E-beam Lithography (MEBL)
Quik-Pak Announces Substrate Development Service
Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced its substrate design, fabrication and assembly service. Utilizing virtually any substrate type, Quik-Pak can create turnkey solutions for substrate-based assemblies to accommodate customers’ unique packaging requirements, with delivery times at least 50 percent faster than those of competitive services.
Emerging Market for Low-Density Panel FO Analyzed
Large area fan-out (FO) remains a hot topic in the industry. There is some confusion over the term “panel” because IC package substrates are processed in panels. The main driver for large area FO panel development is cost reduction because more parts can be processed in a batch. TechSearch International’s latest Advanced Packaging Update report divides the panel market into high-density RDL (≤2μm L/S with multiple RDLs) versus low-density (>5μm L/S with ≤3 RDLs).
SEMI President and CEO Ajit Manocha Set for Induction into Silicon Valley Engineering Hall of Fame
Semiconductor industry veteran and SEMI president and CEO Ajit Manocha will be inducted into the Silicon Valley Engineering Hall of Fame on February 19, 2020. The Silicon Valley Engineering Council (SVEC) is honoring Manocha for championing industry collaboration and driving manufacturing efficiency in multiple leadership roles, as well as for his work as one of the pioneers of reactive ion etching and manufacturing process flows for logic and memory chips that serve as the foundation for modern microelectronics manufacturing.
MKS Announces Series 49UL Thermal Management System
The Series 49UL Thermal Management System with improved heater diagnostics capability and UL and CE safety certifications creates continuous heater monitoring and status, ensuring manufacturing process safety. With heater jackets made of high quality Polyimide or Polytetrafluoroethylene (PTFE), the S49UL provides high temperature operation and uniformity while being light weight and flexible for easy installation.
2020 IEEE International Reliability Physics Symposium to Highlight Latest Research in Reliability for Semiconductor Devices, Microelectronic Systems, and Advanced Technologies
The upcoming 2020 IEEE International Reliability Physics Symposium (IRPS), the industry’s premier technical conference for engineers and scientists to present the latest original research in microelectronics reliability, will be held in Dallas, TX from March 29 – April 2, 2020 at the Hilton DFW Lakes Executive Conference Center. The Symposium will feature a number of special focus sessions highlighting novel and emerging areas of electronic reliability, as well as topics relating to conventional semiconductor, integrated circuit, and microelectronic assembly reliability.
SemiQ Announces Next Generation 650V, 1200V, and 1700V Silicon Carbide Schottky Diode Family
SemiQ (previously Global Power Technologies Group) recently announced the release to production of its new 3rd generation SiC Diode Family featuring blocking voltages of 650V, 1200V and 1700V with forward-current starting at 8 amps up to 50 A per chip. Packages include TO-220-2L, TO-220-3L, TO-247-2L, TO-247-3L, SOT-227, TO-263 as well as bare die.
SEMI Talent Forum to Help Build Next-Generation Chip Industry Workforce
Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum, 6 March 2020 in Swansea, UKat the University of Swansea. Sponsored by SEMI, the industry association representing the global electronics manufacturing and design supply chain, and staged in partnership with European organizations including the University of Swansea, Edwards, Oxford Instruments, and SPTS Technologies, the event will also highlight how technology is reshaping the global workforce. Participation is free of charge and registration is open.
