MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today the company is entering the wireless earphone market with the introduction of a new MOSFET for wireless earphones for preventing the battery from overcharging. This MOSFET is designed to control excessive current flowing into wireless earphones while recharging the battery in order to protect wireless earphones from being damaged.
Packaging
Black Phosphorous Tunnel Field-Effect Transistor as an Alternative Ultra-Low Power Switch?
Researchers have reported a black phosphorus transistor that can be used as an alternative ultra-low power switch. A research team led by Professor Sungjae Cho in the KAIST Department of Physics developed a thickness-controlled black phosphorous tunnel field-effect transistor (TFET) that shows 10-times lower switching power consumption as well as 10,000-times lower standby power consumption than conventional complementary metal-oxide-semiconductor (CMOS) transistors.
CEA-Leti and CEA-IRIG Demonstrate Quantum Integrated Circuit Combining Quantum Dot with Digital-Analog Circuits on CMOS Chip
Leti, an institute of CEA, and CEA-IRIG, a fundamental research institute, have created the world’s first quantum integrated circuit that demonstrates the possibility of integrating conventional electronic devices and elements with quantum dots on a CMOS chip.
Qualcomm Executive Joins Si2 Board of Directors
Pankaj Kukkal, vice president of Engineering at Qualcomm Inc., has been elected to the Silicon Integration Initiative board of directors. Si2 is a leading research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.
Renesas Electronics and 3db Access to Collaborate and Bring Secure Ultra-Wideband Solutions to Market
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, and 3db Access AG, a fabless semiconductor company specializing in secure ultra-wideband (UWB) low power chips, jointly announced that Renesas will license 3db UWB technology and will collaborate to bring best-in-class secure access solutions to the connected smart home, Internet of Things (IoT), Industry 4.0, mobile computing, and connected vehicle applications. The collaboration combines each company’s technical leadership in performance, size reduction, ultra-low power consumption, and security to deliver breakthrough multi-receiver UWB solutions to the global market.
SEMI Industry Strategy Symposium Europe to Explore Tech’s Role in Meeting Region’s Most Pressing Needs
“ISS Europe is a powerful forum for identifying collaboration opportunities to strengthen Europe’s competitive advantage in the digital economy,” said Laith Altimime, president of SEMI Europe. “With the emergence of 5G, artificial intelligence (AI), augmented reality/virtual reality (AR/VR), quantum computing and other leading-edge technologies, the semiconductor industry is well-positioned to help drive the digital transformation for Europe’s societal and economic prosperity.”
David K. Lam to Unveil “Security Lithography” Advances to Thwart IC Counterfeiting at SPIE
Silicon Valley Hall of Famer and Founder of Lam Research to present unsurpassed levels of on-chip security enabled by Multicolumn E-beam Lithography (MEBL)
Quik-Pak Announces Substrate Development Service
Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced its substrate design, fabrication and assembly service. Utilizing virtually any substrate type, Quik-Pak can create turnkey solutions for substrate-based assemblies to accommodate customers’ unique packaging requirements, with delivery times at least 50 percent faster than those of competitive services.
Emerging Market for Low-Density Panel FO Analyzed
Large area fan-out (FO) remains a hot topic in the industry. There is some confusion over the term “panel” because IC package substrates are processed in panels. The main driver for large area FO panel development is cost reduction because more parts can be processed in a batch. TechSearch International’s latest Advanced Packaging Update report divides the panel market into high-density RDL (≤2μm L/S with multiple RDLs) versus low-density (>5μm L/S with ≤3 RDLs).
SEMI President and CEO Ajit Manocha Set for Induction into Silicon Valley Engineering Hall of Fame
Semiconductor industry veteran and SEMI president and CEO Ajit Manocha will be inducted into the Silicon Valley Engineering Hall of Fame on February 19, 2020. The Silicon Valley Engineering Council (SVEC) is honoring Manocha for championing industry collaboration and driving manufacturing efficiency in multiple leadership roles, as well as for his work as one of the pioneers of reactive ion etching and manufacturing process flows for logic and memory chips that serve as the foundation for modern microelectronics manufacturing.
