Value-added distributor Spirit Electronics today announced a distribution agreement with Susumu International Inc., a specialist in thin film technologies and thin film resistors. Susumu develops and manufactures metal thin film chip resistors with high precision, high reliability and high power characteristics.
Packaging
Kingston Technology Takes Top Spot as DRAM Module Supplier
Kingston Technology Company, Inc. today announced it has been ranked the top DRAM module supplier in the world, according to the latest rankings by DRAMeXchange, a division of TrendForce. Kingston retains its number 1 position with an estimated 72.17 percent market share, according to TrendForce.
SEMICON Europa: SMART MedTech Forum Focuses on Innovation, Future of Medical Technology
Cutting-edge medical technology will highlight SEMICON Europa, 12-15 November, 2019 at Messe München, in Munich, Germany, as the SMART MedTech Forum gathers industry experts for insights into the latest developments and trends in medtech innovations driven by semiconductors. The SMART MedTech Forum is Europe’s first event to foster collaboration across the semiconductor and medtech value chains. SEMICON Europa registration is open for visitors and exhibitors.
Narrow Plasmonic Surface Lattice Resonances Prefer Asymmetric Dielectric Environment
A research group led by Dr. LI Guangyuan and Dr. LU Yuanfu from the Shenzhen Institutes of Advanced Technology (SIAT) of the Chinese Academy of Sciences reported a novel type of SLR based on metal-insulator-metal (MIM) arrays. The paper, entitled “Narrow plasmonic surface lattice resonances with preference to asymmetric dielectric environment,” was published on Sep. 2 in Optics Express and was highlighted as an Editor’s Pick.
Delphi Technologies to Partner with Cree for Automotive Silicon Carbide Devices
Delphi Technologies PLC (NYSE: DLPH), a global provider of automotive propulsion technologies, and Cree, Inc. (Nasdaq: CREE), a leader in silicon carbide semiconductors, announce a partnership to utilize silicon carbide semiconductor device technology to enable faster, smaller, lighter and more powerful electronic systems for future electric vehicles (EV).
Nexperia Secures $1,500m Financing to Fund Future Growth Plans
Nexperia, an expert in discrete and MOSFET components and analog & logic ICs, today announced the successful raise of USD 1,500 million equivalent of senior credit facilities. The proceeds will be used to refinance the existing outstanding debt and to partly finance the acquisition by Wingtech Technologies Co., Ltd., a listed Chinese computer and telecom equipment manufacturer.
Samsung Successfully Develops Industry’s First “Key Value” SSD Prototype that Meets New Open Standard
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology, today announced development of the first standards-based prototype of a new type of SSD that features extensive scalability, unmatched durability and CPU-relieving functionality.
New Insulation Technique Paves The Way For More Powerful and Smaller Chips
Researchers at KU Leuven and imec have successfully developed a new technique to insulate microchips.
300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023
300mm fab equipment spending will slowly recover in 2020 after the 2019 downturn and take off in 2021 to log a new record high topping US$60 billion, only to lag again in 2022 and rebound to an all-time peak in 2023, according to the SEMI Industry Research and Statistics group in its first edition of the 300mm Fab Outlook report.
The Quantum Computing Market Is Poised for Strong Growth with Global Revenue to Reach $9.1 Billion by 2030
The global market for quantum computing is being driven largely by the desire to increase the capability of modeling and simulating complex data, improve the efficiency or optimization of systems or processes, and solve problems with more precision.
