Progress moves technology closer to availability of a standard foundry process designed to greatly increase compute performance and energy efficiency.
Packaging
Flash Memory Summit Announces Lifetime Achievement Award Winner for 2019
Flash Memory Summit (FMS), to be held August 6-8 at the Santa Clara Convention Center, is pleased to announce Sanjay Mehrotra as the recipient of its 2019 Lifetime Achievement Award, “for co-founding SanDisk, advancing the architecture that enabled the industry and marketplace for flash memory, and leadership of Micron Technology, Inc. and the Semiconductor Industry Association.”
North American Semiconductor Equipment Industry Posts June 2019 Billings
June billings of North American equipment manufacturers fell nearly three percent when compared to the prior month.
TriLumina Announces World’s First Automotive-Qualified AEC-Q102 Grade 1 Semiconductor Laser
This marks the first time any semiconductor laser product has qualified for AEC-Q102 Grade 1 Operation.
SiC Power Industry: Ready for Take-Off?
The adoption of SiC power devices is now undeniable. The power electronics industry has no more questions about it. Today, questionings are more related to the companies and the playground: how and when they will make it.
Amkor Leads 5G mmWave Smartphone, IoT and Emerging Applications with Antenna-in-Package Technology
Amkor Technology, Inc. (Nasdaq: AMKR), a provider of outsourced semiconductor assembly and test (OSAT) services, is paving the way for 5G mmWave antenna-in-package (AiP) technology.
SEDC, CEG, and Cadence Highlight Campaign Enabling Innovation in Chip Design through the EDI 2 Saratoga Program Agreement Signed at SEMICON West
In a news conference at the inaugural ES Design West of SEMICON West, SEDC and Cadence announced the launch of a campaign by SEDC to actively recruit entrepreneurs and startups to NY’s growing advanced electronics cluster.
ULVAC Names New Senior Management for North American subsidiary, ULVAC Technologies, Inc.
ULVAC Technologies, Inc. has announced that Dr. Koukou Suu, of ULVAC Japan, will serve as the new CEO of ULVAC’s North American subsidiary, ULVAC Technologies, Inc., based in Methuen, MA.
Changes in the Advanced Packaging Supply Chain: Opportunity or Misfortune?
Amidst a dynamic ecosystem, the semiconductor supply chain is undergoing change at various levels. Some players have successfully managed to expand into a new business model and significantly impact the IC manufacturing chain, while others have failed to take off.
Toshiba Memory to Rebrand as “Kioxia” in October
Toshiba Memory Holdings Corporation announced today that it will officially change its name to Kioxia Holdings Corporation on October 1, 2019.
