Samsung Electronics Co. today announced that it has begun mass producing the industry’s first 12-gigabit (Gb) LPDDR5 mobile DRAM, which has been optimized for enabling 5G and AI features in future smartphones.
Packaging
Pioneer Micro Technology Launches Silvaco PDK for Its 0.35 µm Silicon Foundry CMOS Process
Silvaco Japan Co., Ltd. today announced that Pioneer Micro Technology Corp. (PMT) has begun providing a Process Development Kit (PDK) for Silvaco tool users targeting the manufacture of IC designs in PMT’s 0.35 µm CMOS process technology.
Semiconductor Intellectual Property (IP) Market to Grow at 8.8% During 2018-2026 on the Back of Advancements in Multi-core Technology
The global semiconductor intellectual property market is prognosticated to expand at steady CAGR of 8.8% within the forecast period from 2018 to 2026. By the end of 2026, the semiconductor IP market is likely to be valued around worth US$ 9,437.8 mn.
Alpha and Omega Semiconductor Introduces New Source Down Packaging Technology
Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of power semiconductors and power ICs, today introduced the “Source Down” in a DFN 5×6 package in combination with a 40V Shield-Gate Technology (AlphaSGT™). AOS’ innovative flip-chip know-how achieves the Source Down capability and this packaging technology offers a very low package resistance and inductance. The AOE66410 is ideally suited in telecommunications applications…
Intel Unveils New Tools in Its Advanced Packaging Toolbox
Last week at SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel’s advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB and Foveros together and a new Omni-Directional Interconnect (ODI) technology.
Synopsys Awarded DARPA ERI Contract Extension
Synopsys, Inc. (Nasdaq: SNPS) today announced a contract extension from the Defense Advanced Research Projects Agency (DARPA) for the Posh Open Source Hardware (POSH) program to continue innovations in analog/mixed-signal (AMS) verification.
The MOSIS Service Selects Synopsys’ IC Validator for Large-scale FinFET SoCs
Synopsys, Inc. today announced that The MOSIS Service, a provider of Multi-Project Wafers, has selected Synopsys’ IC Validator tool for physical verification signoff.
Worldwide PC Shipments Grew 1.5 Percent in Second Quarter of 2019
After two quarters of decline, the worldwide PC market grew 1.5% in the second quarter of 2019, according to preliminary results by Gartner, Inc. Shipments totaled 63 million units in the second quarter of 2019, up from 62 million units in the second quarter of 2018.
Digi-Key Announces Exclusive Global Distribution Partnership with Helix Semiconductors
Digi-Key Electronics, a global electronic components distributor, announces that it has expanded its product portfolio by signing an exclusive global distribution partnership with Helix Semiconductors.
Standards Industry Leaders Honored at SEMICON West 2019
SEMI yesterday honored five industry leaders at SEMICON West 2019 for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were announced at the SEMI International Standards 1000th Standard Celebration.
