Packaging

Lam Research Appoints Ita Brennan and Mark Fields to Board of Directors

Lam Research Corp. today announced that Ita Brennan and Mark Fields have joined its board of directors, effective August 30, 2024.

IEDC to Target Semiconductor Innovation and Launch New Taiwan Office

Indiana will showcase its bold, future-focused strategy at SEMICON Taiwan and announce a new office in Taipei to further develop relationships and two-way trade opportunities.

SK hynix Develops Industry’s First 1c DDR5

SK hynix Inc. announced today that it has developed the industry’s first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process.

HeterMM: Applying in-DRAM Index to Heterogeneous Memory-Based Key-Value Stores

Emerging byte-addressable storage technologies, such as NVM, provide a more cost-effective and larger-capacity alternative to DRAM, presenting new opportunities to address the high cost, limited capacity, and volatility of in-memory key-value (KV) stores.

Researchers Unveil Scalable Graphene Technology to Revolutionize Battery Safety and Performance

Researchers at Swansea University, in collaboration with Wuhan University of Technology, Shenzhen University, have developed a pioneering technique for producing large-scale graphene current collectors.

Keysight Unveils Wire Bond Inspection Solution for Semiconductor Manufacturing

Keysight Technologies, Inc. (NYSE: KEYS) introduces the Electrical Structural Tester (EST), a wire bond inspection solution for semiconductor manufacturing that ensures the integrity and reliability of electronic components.

Efficient and GlobalFoundries Partner to Enable a New Category of Ultra Energy-Efficient, High-Performance Processors

Today, Efficient announced a strategic partnership with GlobalFoundries (GF) to bring to market a new high-performance computer processor that is up to 166x more energy-efficient than industry-standard embedded CPUs.

Tech Industry Veteran Anders Storm Named Chief Executive Officer of Dirac Research AB

Thirty-year software, engineering, and semiconductor industry veteran brings deep technical knowledge and C-level executive management experience to Dirac.

Nordson Electronics Solutions to Feature High-Throughput Fluid Dispensing Technologies at SEMICON Taiwan 2024

Nordson Electronics Solutions will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.

Lita Shon-Roy, President/CEO of TECHCET Wins Gold Stevie Award in 2024 International Business Awards

Lita Shon-Roy, President and CEO of TECHCET, was named the winner of a Gold Stevie Award in the Thought Leader of The Year – Business Services category in The 21st Annual International Business Awards for her work as a Semiconductor Materials Supply Chain Thought Leader. 

Featured Products