Andes Technology and Arteris partnership aims to support the growing adoption of RISC-V SoCs by mutual customers.
Packaging
Wise-integration & Leadtrend Technology Introduce GaN System-in-Package
Wise-integration and Leadtrend Technology Corporation, a specialist in analog and analog-digital mixed-mode IC designs, today announced the release of a GaN system-in-package (SiP) supporting consumer electronics applications.
SEMICON Europa 2024 Call for Abstracts Opens
Presentation abstracts now accepted for Advanced Packaging Conference, Fab Management Forum, and MEMS & Imaging Sensors Summit.
Micron Expands Workforce Development Collaborations to Meet Future Semiconductor Job Demand
Partnership with GlobalFoundries and the U.S. National Science Foundation, along with MSI Semiconductor Network and new commitments to aid groups, critical to building semiconductor talent pipeline.
GlobalFoundries Appoints KC Ang as President of Asia
Industry veteran to expand company’s business development and strategic partnerships in Asia with focus on China.
Viking Technology Introduces Industry’s Highest Density 16GB DDR4 Multi-Chip Package
Viking Technology, a division of Sanmina Corporation, announces their newly released 16GB DDR4 Multi-Chip Package (MCP).
European Chips Skills Academy Launches Summer School in Italy to Promote Microelectronics Industry Careers
University students will connect with professors to explore semiconductor learning paths and employment opportunities at the European Chip Skills Academy Summer School, August 18-23, 2024 in Bologna, Italy.
RISC-V Adoption Will Be Accelerated by AI, According to New Omdia Research
RISC-V processors will account for almost a quarter of the global market by 2030, according to new research by Omdia.
RS Offers Banner Engineering’s Extensive Portfolio of Sensor Products for Industrial Automation Applications
The comprehensive RS selection of Banner sensors includes an array of sensing technologies — including photoelectric, laser, and radar — and can help improve the accuracy, productivity, uptime, and efficiency of almost any industrial automation application.
Honda and IBM Sign MOU to Explore Long-term Joint Research and Development of Semiconductor Chip and Software Technologies
Agreement outlines intent to research and develop solutions to new challenges related to processing performance, power consumption, and design complexity.
