Renesas Electronics Corporation today announced that it has started operations at its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan.
Packaging
IMAPS & IPC to Host Onshoring Workshop
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
Rapidus Announces U.S. Subsidiary and Opens Silicon Valley Office
Rapidus Corporation today announced it has formed a U.S. subsidiary, Rapidus Design Solutions (RDS); opened an office for the Americas in Santa Clara, California; and named long-time semiconductor executive Henri Richard as general manager and president of the U.S. organization.
Infineon and Amkor Announce Extended Partnership
Infineon Technologies AG is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a provider of semiconductor packaging and test services.
Semiconductor Advanced Packaging Market Size to Record $22.79B Growth from 2024-2028
The global semiconductor advanced packaging market size is estimated to grow by USD 22.79 billion from 2024 to 2028, according to Technavio.
SEMI Issues Statement on Change to U.S. CHIPS Act Notice of Funding Opportunity
SEMI today issued the following statement from Ajit Manocha, SEMI President and CEO, after the United States Government announced it will no longer move forward with the Notice of Funding Opportunity for CHIPS funding for the construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States.
Semiconductor Research Corporation Announces 2024 Call for Research, $13.8M in Funding Opportunities
Semiconductor Research Corporation (SRC) is announcing the start of solicitation season with $13.8 million in funding opportunities.
Global Semiconductor Equipment Billings Slip to $106.3 Billion in 2023
Worldwide sales of semiconductor manufacturing equipment edged down 1.3% to $106.3 billion in 2023 from an all-time record of $107.6 billion in 2022, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported today.
Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms
Micron’s automotive memory and storage enable central compute, digital cockpit and advanced driver-assistance systems for Qualcomm customers.
SEMI Applauds U.S. CHIPS Act Award for TSMC Manufacturing Facilities
“We applaud the U.S. Department of Commerce for taking this significant step to enhance the resilience of the domestic semiconductor supply chain,” said Joe Stockunas, President of SEMI Americas.
