Institute’s panel brought together key stakeholders for panel discussion on workforce development in growing semiconductor manufacturing industry, highlights the City of Phoenix’s efforts.
Packaging
Micron Commences Volume Production of Industry-Leading HBM3E Solution to Accelerate the Growth of AI
Micron Technology, Inc. today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution.
Intel Foundry Expands Support for Ansys Multiphysics Signoff Solutions with Intel 18A Process Technology
Intel Foundry certified Ansys (NASDAQ: ANSS) multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 18A process technology with new RibbonFET transistor technology and backside power delivery.
TSMC’s Kumamoto Plant (JASM) Grand Opening on 24th February
TrendForce’s latest report reveals that in 2023, global foundry revenues hit US$117.47 billion, with TSMC capturing a dominant 60% share.
Mixed-Dimensional Transistors Enable High-Performance Multifunctional Electronic Devices
A research team led by materials scientists from City University of Hong Kong (CityUHK) recently discovered a new strategy for developing highly versatile electronics with outstanding performance, using transistors made of mixed-dimensional nanowires and nanoflakes.
Intrinsic ID Joins Intel Foundry Accelerator IP Alliance to Secure Leading-Edge Semiconductors
Intrinsic ID, the provider of Physical Unclonable Function (PUF) technology field-proven in more than 650 million devices across the globe, today announced that it is now a member of the Intel Foundry Accelerator IP Alliance program to ensure the availability of hardware-based root-of-trust (RoT) solutions for Intel Foundry customers.
Fujitsu Collaborates With QuTech
Fujitsu today announced a collaboration with QuTech for the development of the world’s first cryogenic electronic circuits for controlling diamond-based quantum bits.
IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC
Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.
Ideal Power Successfully Completes Phase II of Development Program with Stellantis
Ideal Power Inc. today announced the successful completion of Phase II deliverables of a product development agreement with Stellantis, a top 10 global automaker.
ASIP’s OSAT/ATMP Project Launched With Korean JV
Hyderabad based ASIP (Advanced System in Package Technologies) has announced the launch of its project with Korean company APACT Limited as a Joint Venture
