The nEDC300 from EDWARDS VACUUM is the latest iteration of mono claw vacuum pumps which boasts a range of inventive attributes that not only boost performance but also minimize noise levels, improve reliability, and facilitate on-site maintenance.
Packaging
Rupert Baines Appointed CEO at QPT
QPT, a specialist in developing next generation GaN-based motor drives, has appointed Rupert Baines as its CEO with effect from 1 April 2024.
SCALINX Secures €34 Million in Second Round Funding
SCALINX, a fabless semiconductor company based in France and specializing in advanced mixed-signal chip design, has successfully concluded its second funding round, securing a global investment of €34 million.
Global Advanced IC Substrate Market Size is Projected to Reach $14.2B in 2030
With the proliferation of new IC types such as BGA (ball grid array) and CSP (chip scale package), which require different package carriers, IC substrate has significantly changed.
Renesas to Acquire Transphorm to Expand its Power Portfolio with GaN Technology
Acquisition accelerates Renesas’ wide bandgap expertise and roadmap to fast-growing market opportunities for EVs, data centers & AI power, and renewable energy.
TI Debuts New Automotive Chips at CES
Texas Instruments today introduced new semiconductors designed to improve automotive safety and intelligence.
National Semiconductor and Advanced Manufacturing Technician Apprenticeship Program Launched to Support State Efforts to Develop Strategic Talent Pipelines
Today the National Institute for Innovation and Technology—the nation’s leader in the semiconductor talent pipeline development and U.S. Department of Labor (USDOL) national Intermediary responsible for establishing and expanding Registered Apprenticeships (RAs) throughout semiconductor and nanotechnology-related industry supply chains—launched the national Semiconductor and Advanced Manufacturing Technician Apprenticeship Program (SAM-TAP).
SIA Applauds Announcement of New CHIPS Incentives
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced today by the U.S. Department of Commerce and Microchip Technology.
Biden-Harris Administration Announces CHIPS Preliminary Terms with Microchip Technology
The Biden-Harris Administration announced that the U.S. Department of Commerce and Microchip Technology Inc. have reached a non-binding preliminary memorandum of terms (PMT) to provide approximately $162 million in federal incentives under the CHIPS and Science Act to support the onshoring of the company’s semiconductor supply chain.
