Key Foundry, an 8-inch pure-play foundry in Korea, announced today that it has changed its corporate name to SK keyfoundry.
Packaging
Enpro Inc. to Acquire Advanced Micro Instruments, Inc.
Under the terms of the agreement, Enpro will acquire AMI for $210 million in cash.
Diodes Incorporated Announces Promotion of Gary Yu to President
Diodes Incorporated today announced that as part of a multi-year CEO succession plan its board of directors has approved the promotion of Gary Yu to President effective January 2, 2024.
Teledyne e2v HiRel Expands Portfolio of Space-Screened GaN HEMTs
Additional packaged GaN HEMTs for hi-rel applications now available off the shelf with Space Screening Flow.
Magnachip Commences Full-Scale Mass Production of New 30V MXT LV MOSFET for Electric Power Steering Systems
This MOSFET product is being used by a global automaker.
Enablence Technologies Supplies Opterro Inc. with Broad Range of Cutting Edge Optical Chips
Both companies have worked together to co-develop and integrate Enablence’s high quality, unique, customized arrayed waveguide gratings (AWG) with Opterro’s advanced sensing technologies.
SEMI Recognizes Edwards at SEMICON Europa 2023 for Exceptional Leadership, Diversity, and Inclusion
SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion announced Edwards as the recipient of the 2023 SEMI Industry Leader in Diversity and Inclusion Award.
Senate Unanimously Confirms Michelle Giuda as Member of Bipartisan Board to U.S. Agency for Global Media
The Krach Institute for Tech Diplomacy at Purdue announced today that its CEO, Michelle Giuda, has been unanimously confirmed by the U.S. Senate to serve on the newly formed bipartisan International Broadcasting Advisory Board.
GlobalLogic Announces Acquisition of Mobiveil
GlobalLogic, a Hitachi Group Company, today announced that it has entered into a definitive agreement to acquire Mobiveil, a specialized embedded engineering services firm headquartered in the United States.
Camtek Receives Order for 25 Metrology & Inspection Systems from a Leading OSAT for Advanced Packaging Applications
Camtek Ltd. today announced that it has received an order of 25 systems from a leading Outsourced Semiconductor Assembly and Test (OSAT) for various Advanced Packaging applications.
