The path to continuous improvement for semiconductor manufacturers got a lot easier today with the announcement by Aidentyx, Inc. that it has rolled out the chip industry’s first Manufacturing AI framework featuring multiple applications, each backed by specialized AI engineering agents orchestrating smart, secure, and net-zero-friendly AI analytics that promote greater interoperability, collaboration, and increased performance among applications and data sources.
Semiconductors
Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation, today announced that it has joined Intel Foundry Accelerator Ecosystem Alliance Program, as a member of both the IP Alliance and the recently announced Chiplet Alliance.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
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Siemens and Intel Foundry Advance Collaboration
Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement.
Worldwide Silicon Wafer Shipments Increase 2% Year-on-Year in Q1 2025, SEMI Reports
Worldwide silicon wafer shipments increased 2.2% year-on-year (YoY) to 2,896 million square inches (MSI) from the 2,834 MSI recorded during the same quarter of 2024.
Northeast Microelectronics Coalition Hub Launches $10 Million SCALE Capital Program to Advance Microelectronics Industry
The Northeast Microelectronics Coalition (NEMC) Hub, a division of the Massachusetts Technology Collaborative (MassTech) launched the SCALE Capital program, a $10 million grant initiative to advance microelectronics capability, training and product development across Massachusetts.
Veeco’s WaferStorm and WaferEtch Wet Processing Platforms Qualified for Advanced Packaging Applications
Veeco Instruments Inc. today announced a global Semiconductor IDM qualified Veeco’s WaferStorm and WaferEtch platform for two new applications in Advanced Packaging.
HKUST Research Sheds Light on Future Applications in Spintronics and Valleytronics
A team led by Prof. LIU Junwei from the Department of Physics at the Hong Kong University of Science and Technology (HKUST), along with their experimental collaborators, published their latest research findings in Nature Physics, which unveiled the first experimental observation of a two-dimensional layered room-temperature altermagnet, validating the theoretical predictions in Nature Communications made by Prof. Liu in 2021.
Seoul Semiconductor: Unified Patent Court Orders Recall of Products Infringing Essential Micro LED Patents
Seoul Semiconductor Co., Ltd., a global innovator of LED products and technology, announced that the Local Division Paris of the Unified Patent Court (UPC), which has jurisdiction across 18 European countries, has issued a judgment that Laser Components SAS infringed Seoul Semiconductor affiliate’s core optical semiconductor patent.
