This week, at the 2023 Advanced Lithography + Patterning Conference, imec presents a quantitative assessment of the environmental impact of patterning in advanced IC manufacturing.
Semiconductors
EUV Tech and IBM Join the eBeam Initiative
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announces the addition of two new company members to the organization.
MITRE Engenuity and Semiconductor Alliance Position Paper Outlines Guidance for National Semiconductor Technology Center Incubation
Ensuring the United States improves its global competitiveness in semiconductors requires strategic deployment of the $52.7 billion in funding authorized in the CHIPS + Science Act.
Samsung, Micron, and SK Hynix Account for Three-Fourths of Leading-Edge Wafer Capacity
At the end of 2022, Samsung, Micron, and SK Hynix accounted for 76% of leading-edge capacity, with the vast majority of it for advanced DRAM and 3D NAND production.
Semiconductor Wet Chemicals 1H2023 Trending Down
Although 200+ new layer chip offerings are expected in 2023.
Applied Materials’ Pattern-Shaping Technology Reduces the Cost, Complexity and Environmental Impact of Advanced Chip Manufacturing
Applied Materials, Inc. today unveiled a breakthrough in patterning technology that allows chipmakers to create high-performance transistors and interconnect wiring with fewer EUV lithography steps, thereby lowering the cost, complexity and environmental impact of advanced chipmaking.
Infinitesima Announces First Customer Shipment of Metron3D In-Line Probe Metrology System
Infinitesima have completed the first customer shipment of the Metron3D metrology system, a revolutionary sub-nanometer, high speed 3D imaging system that operates at in-line production throughputs.
Applied Materials’ New eBeam Metrology System Paves the Way to High-NA EUV Lithography
Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of semiconductor device features patterned with EUV and emerging High-NA EUV lithography.
Arctic Semiconductor and Compal Introduce World’s First Universal Small Cell Infrastructure Platform for 5G Networks
Arctic Semiconductor today announced that its groundbreaking RF transceiver, IceWings is powering a new universal 5G small cell infrastructure platform from Compal Electronics, one of the world’s largest ODMs.
imec at SPIE Advanced Lithography + Patterning 2023
This year at SPIE Advanced Lithography + Patterning, imec has a record number of 70 contributions, of which 42 first authored papers and 28 co-authored papers.
