Greene Tweed, a global manufacturer of high-performance sealing solutions and engineered components, announces the introduction of Chemraz G57, a perfluoroelastomer that Greene Tweed material scientists and application engineers specifically developed to meet the demands of aggressive dry plasma systems and other extremely demanding semiconductor fabrication sealing applications.
Semiconductors
One Year After Enactment, CHIPS & Science Act is on Path to Success; Work Remains to Maximize Impact
Semiconductor Industry Association (SIA) President and CEO John Neuffer today released the following statement regarding the one-year anniversary of enactment of the CHIPS and Science Act, a landmark law that provides $52 billion for semiconductor manufacturing incentives and research initiatives.
TSMC to Build Multi-Billion-Euro Chip Factory in Germany
Taiwanese semiconductor manufacturer TSMC plans to construct a massive new production facility in the eastern German city of Dresden.
NEO Semiconductor 3D X-DRAM Awarded “Best of Show” for Most Innovative Memory Technology
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash and DRAM memory, today announced that its ground-breaking technology, 3D X-DRAM, captured the top prize at Flash Memory Summit 2023, winning the “Best of Show” award for the Most Innovative Memory Technology.
Researchers Discover a Potential Application of Unwanted Electronic Noise in Semiconductors
Random telegraph noises in vanadium-doped tungsten diselenide can be tuned with voltage polarity.
Membrion Series B Round Closes at $12.5M
Samsung Ventures and Lam Capital invest in Membrion sustainable solutions for industrial and semiconductor wastewater.
Governor Hochul Announces the Establishment of World-Class AMD Design Centers in New York State
High-performance semiconductor design company commits to creating 165 new jobs in two New York State locations.
2023 Semiconductor Materials Market Slowing but Resilient
Material growth to resume in 2024 as industry recovers and fabs ramp up.
Crystal IS and Asahi Kasei Announce First 4-inch Aluminum Nitride Substrate
Crystal IS has achieved 4-inch (100 mm) diameter bulk aluminum nitride substrate.
SK hynix Showcases Samples of World’s First 321-Layer NAND
SK hynix Inc. showcased today the sample of the 321-layer 4D NAND, making public the progress on its development of the industry’s first NAND with more than 300 layers.
