Advanced semiconductors expected to offer superior energy savings in support of decarbonization.
Semiconductors
AMD Announces Plan to Invest Approximately $400 Million Over the Next Five Years to Expand Operations in India
Investment expected to create largest AMD design center with addition of approximately 3,000 engineering roles and new Bangalore campus opening before end of 2023.
NEO Semiconductor to Present Its Ground-Breaking 3D NAND and 3D DRAM Architectures in Keynote Address at Flash Memory Summit 2023
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash and DRAM memory, today announced its participation at Flash Memory Summit 2023, taking place in person in Santa Clara, California, on August 8-10.
Insight Global Announces Formal Division to Address Semiconductor Workforce Challenges
National staffing company building new path forward to fill talent gaps for rapidly expanding industry.
Yield Engineering Systems Opens New Advanced Technology Center in Arizona to Support Semiconductor Growth in the US
Yield Engineering Systems (YES), a provider of technology solutions and process equipment for the semiconductor ecosystem and applications, held a ribbon-cutting ceremony today for its new 123,000-square-foot facility in Chandler, Arizona.
onsemi and Magna Sign Strategic Agreement, Invest in Silicon Carbide Manufacturing for Growing Electric Vehicle Market
Magna to integrate onsemi EliteSiC into its traction inverter solutions to improve range and efficiency of electric vehicles.
Enhanced Light Absorption in Thin Silicon Photodetectors with Photon-Trapping Structures
Researchers devise an approach to vastly enhance the near-infrared absorption in silicon, which could lead to affordable, high-performance photonic devices.
Materials “Sweet-spot” – ALD/CVD Precursor Supply Chain
Mo may replace HVM applications, which could reduce future WF6 supply strains.
Micron Delivers Industry’s Fastest, Highest-Capacity HBM to Advance Generative AI Innovation
Micron Technology, Inc. today announced it has begun sampling the industry’s first 8-high 24GB HBM3 Gen2 memory with bandwidth greater than 1.2TB/s and pin speed over 9.2Gb/s, which is up to a 50% improvement over currently shipping HBM3 solutions.
Department of Commerce and Department of Defense Sign Memorandum of Agreement to Strengthen U.S. Defense Industrial Base
The United States Departments of Commerce (DoC) and Defense (DoD) have signed a Memorandum of Agreement (MOA) to expand collaboration to strengthen the U.S. semiconductor defense industrial base.
