Semiconductors

Beyond Semiconductor Packaging Materials: Advanced Silicone Solutions

Advanced silicones are enabling semiconductor manufacturers to address a variety of challenges.

Gov. Whitmer Announces New Semiconductor Career and Apprenticeship Network Program Aimed at Creating Good-Paying Jobs

Today, Governor Gretchen Whitmer joined the Michigan Economic Development Corporation to announce Michigan Strategic Fund (MSF) approval of support for a new semiconductor technician apprenticeship program intended to strengthen the pipeline of the semiconductor workforce.

EV Group Lithography Solutions for Heterogenous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2022

EV Group (EVG) announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced lithography solutions will be highlighted in several papers being presented at the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), to be held May 31-June 3 in San Diego, Calif.

Samsung Electronics and Red Hat Announce Collaboration in the Field of Next-Generation Memory Software

Samsung Electronics Co., Ltd. and Red Hat, Inc. today announced a broad collaboration on software technologies for next-generation memory solutions.

Argonne Scientists Use Quantum Computers to Simulate Quantum Materials

Scientists achieve important milestone in making quantum computing more effective.

Diamondx Selected for Internet of Things Semiconductor Test

Cohu, Inc. today announced a U.S. semiconductor manufacturer has selected the Diamondxplatform for testing their product portfolio.

GS Microelectronics (GSME) Enters Market as Globally Focused Outsourced Semiconductor Manufacturing and Operations Solutions Provider

GS Microelectronics, Inc. today announced its official launch as a global provider of Outsourced Semiconductor Manufacturing and Operations (OSeMO) services.

Showa Denko’s Program to Develop 8-inch SiC Wafers for Next-generation Green Power Semiconductor Selected for NEDO’s Green Innovation Fund Projects

Showa Denko proposed its “Project to Develop SiC Wafers Technology for Next-generation Green Power Semiconductors”  to New Energy and Industrial Technology Development Organization (NEDO) as a candidate for “Projects to Develop Wafers Technology for Next-generation Power Semiconductors” which was set as a research and development target of “Next-generation Digital Infrastructure Construction” in “Green Innovation Fund Projects”.

Enhancing Performance, Quality and Yield in Current and Emerging Display Technologies

Process metrology, failure analysis, and core-structure characterization can be invaluable in accelerating research and development, enhancing yield and improving display quality.

China-Based IC Production to Represent 21.2% of China IC Market in 2026

Foreign companies (e.g., Samsung, SK Hynix, TSMC, etc.) are expected continue to comprise more than 50% of IC production in China through 2026.

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