ROHM Semiconductor today announced mass production technology for Short-Wavelength Infrared (SWIR) devices in the industry’s smallest class 1608-size (1.6mm × >0.8mm) for portable / wearable / hearable devices requiring material detection.
Semiconductors
Creation of Thinnest Freestanding Film With Ferroelectric Properties Ever Opens the Door to Smaller, More Efficient Devices
Researchers at the Institute for Future Materials and Systems at Nagoya University in Japan have successfully synthesized barium titanate (BaTiO3) nanosheets with a thickness of 1.8 nanometers, the thinnest thickness ever created for a free-standing film.
Marvell Demonstrates Industry’s First 3nm Data Infrastructure Silicon
Marvell Technology, Inc. has demonstrated high-speed, ultra-high bandwidth silicon interconnects produced on Taiwan Semiconductor Manufacturing Company’s (TSMC) 3-nanometer (3nm) process.
SK hynix Develops Industry’s First 12-Layer HBM3
SK hynix Inc. announced today it has become the industry’s first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in the industry, and said customers’ performance evaluation of samples is underway.
SkyWater President and CEO Thomas Sonderman to Deliver Keynote at 2023 ASMC
Keynote to highlight impact of CHIPS Act on semiconductor manufacturing sector and importance of secure sources for critical emerging technology innovations.
Take a Look Inside a Vacuum Gauge: Pfeiffer Vacuum Publishes Easy-to-Understand Videos
To assist in choosing the right measurement principle, Pfeiffer Vacuum has made helpful explanatory videos that give a detailed insight into the inner workings and functionality of vacuum gauges.
U.K.’s Space Forge Announces Plans to Launch U.S. Manufacturing Operations
U.K.-based Space Forge Ltd., which is pioneering space-based super materials manufacturing, announced today it is launching operations in the United States.
GlobalFoundries Files Lawsuit Against IBM
GlobalFoundries today sued IBM for trade secret misappropriation.
Purdue Convenes CHIPS Summit in D.C. With Sec. Raimondo and Sen. Young
Leaders from industry, government and academia convened at a summit Tuesday (April 18) in Washington, D.C. to forge national solutions at scale to address the future of U.S. innovation in microelectronics and the semiconductor workforce.
SIA Applauds House Introduction of Bipartisan Legislation to Restore Immediate Deductibility of R&D Investments
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the introduction in the House of Representatives of bipartisan legislation to restore full tax deductibility of R&D investments.
