A pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing industry today announced the launch of the GENESIS project.
Semiconductors
FAMES Pilot Line Launches FAMES Academy
The FAMES Pilot Line today announced the official launch of the FAMES Academy, a strategic educational initiative designed to support the EU’s commitment to develop next-generation chips.
G7 Representatives Gather in Markham and Toronto to Strengthen Global Semiconductor Partnerships
Representatives from G7 nations convened in Markham and Toronto on June 3 to discuss international collaboration and priorities for the future of semiconductors.
Alphawave Semi Tapes Out Breakthrough 36G UCIe IP on TSMC 2nm
Alphawave Semi announced the successful tape out of one of the industry’s first UCIe IP subsystem on TSMC’s N2 process, supporting 36G die-to-die data rates.
Reducing Scope 2 Emissions in Semiconductor Manufacturing – A Happy Coincidence
Introducing new technologies to reduce emissions not only provides an environmental benefit but can lead to significant financial benefits as well. Materials, utilities, and energy all have a real cost, and reducing their consumption significantly reduces total cost of ownership (TCoO).
A Collaborative Supply Chain Won’t Just Grow Businesses – It’ll Accelerate Global Innovation
Limiting structures and siloed working, complexities in both production and supply, disruptions caused by climate change and geopolitics, and changes in trade policy are just a handful of challenges semiconductor companies are particularly susceptible to.
Engineered for Excellence: Advanced Materials in Semiconductor Fluid Delivery Systems
The evolution of stainless-steel compounds—specifically tailored 316L solutions with stringent residual and melt chemistry controls—has proven indispensable in safeguarding critical gas delivery systems.
Sarcina Technology Advances Photonic Package Design to Address Key Data Center Challenges
Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO), which address fundamental challenges facing data centers about how to deal with the rapidly increasing amount of data as AI evolves.
Thin Film Interconnect and Heisler Semiconductor LLC Announce Strategic Technology Partnership
Creating an end-to-end solution for wafer production.
GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth
Backed by leading tech giants, the investment reinforces domestic semiconductor production and U.S.-based innovation in AI-enabling and power efficient technologies.
