Seoul Semiconductor Co., Ltd., a global innovator of LED products and technology, announced that the Local Division Paris of the Unified Patent Court (UPC), which has jurisdiction across 18 European countries, has issued a judgment that Laser Components SAS infringed Seoul Semiconductor affiliate’s core optical semiconductor patent.
Semiconductors
Researchers Develop a Novel Annealing Processing System
In a groundbreaking study, a research team from Japan, led by Professor Takayuki Kawahara from the Department of Electrical Engineering at Tokyo University of Science, Japan, developed an innovative dual scalable annealing processing system (DSAPS) that can simultaneously scale both capacity and precision using the same scalable structure.
NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips
NEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened electronic subsystems to support future space missions.
2024 Global Semiconductor Materials Market Posts $67.5 Billion in Revenue, SEMI Reports
Global semiconductor materials market revenue increased 3.8% to $67.5 billion in 2024, SEMI, the global industry association representing the electronics design and manufacturing supply chain, reported today in its Materials Market Data Subscription (MMDS).
Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031
The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
OKI Circuit Technology has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
ROHM Develops New High Power Density SiC Power Modules
ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles).
ChEmpower Secures $18.7M to Advance Abrasive-Free Planarization in Chip Manufacturing
New investment to drive sustainability in advanced AI chip manufacturing.
M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
M31 Technology Corporation (M31), a global provider of silicon intellectual property (IP), today announced that its eUSB2 PHY IP has achieved silicon-proven status on TSMC’s 3nm process and has successfully completed tape-out on TSMC’s 2nm process.
Siemens Collaborates with TSMC to Drive Further Innovation in Semiconductor Design and Integration
Siemens Digital Industries Software today announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.
