Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of semiconductor device features patterned with EUV and emerging High-NA EUV lithography.
Semiconductors
Arctic Semiconductor and Compal Introduce World’s First Universal Small Cell Infrastructure Platform for 5G Networks
Arctic Semiconductor today announced that its groundbreaking RF transceiver, IceWings is powering a new universal 5G small cell infrastructure platform from Compal Electronics, one of the world’s largest ODMs.
imec at SPIE Advanced Lithography + Patterning 2023
This year at SPIE Advanced Lithography + Patterning, imec has a record number of 70 contributions, of which 42 first authored papers and 28 co-authored papers.
Researchers Pioneer Process to Stack Micro-LEDs
Researchers from the Georgia Institute of Technology, in collaboration with researchers from the Massachusetts Institute of Technology (MIT), have developed a new process based on 2D materials to create LED displays with smaller and thinner pixels.
pSemi Announces Industry-leading 5G mmWave Switch Reaches Volume Production
pSemi Corporation, a Murata company focused on semiconductor integration, announces the production readiness of a new SP4T switch targeted for wideband and high frequency applications up to 52 GHz.
McMaster University Develops Novel Experimental Designs with ZEISS LaserFIB and Next-Generation 3D X-ray Microscope
The Canadian Centre for Electron Microscopy (CCEM), located at McMaster University, recently acquired a ZEISS Crossbeam 350 laser FIB-SEM and a next-generation Versa 3D X-ray microscope.
NAB Show to Explore Next Generation of Content Delivery Systems
The NAB Show Broadcast Engineering and IT (BEIT) Conference will offer forward-focused insights into the technical issues, challenges and opportunities affecting the future of content delivery ecosystems.
STATS ChipPAC’s Automotive Millimeter Wave Radar Packaging Solution Receives Customer Award
STATS ChipPAC PTE. LTD. won the “Excellent Supplier Award of 2022” issued by Calterah.
Samsung Electronics Introduces Standardized 5G NTN Modem Technology to Power Smartphone-Satellite Communication
Samsung Electronics Co., Ltd. today announced that it has secured standardized 5G non-terrestrial networks (NTN) modem technology for direct communication between smartphones and satellites, especially in remote areas.
Lynceus and NXP Semiconductors Partner to Qualify AI for Automotive Chip Production
Lynceus, a developer of artificial intelligence (AI)-powered predictive process control, and NXP Semiconductors today presented a case study on “Qualifying AI for Automotive Production” at the Fab Owners Alliance (FOA) Q1 Collaborative Forum in Phoenix, Ariz.
