This is the first tape-out of Weebit ReRAM in 22nm, one of the industry’s most common process nodes, and a geometry where embedded flash is not viable.
Semiconductors
Ambarella Partners With Applied Intuition to Offer Scalable HIL Testing for CV3-AD Domain Controller SoCs
Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, and Applied Intuition, a software solutions provider for autonomous vehicle (AV) development, today at CES 2023 announced a partnership to offer a joint ADAS and AV development solution based on Ambarella’s CV3-AD PCIe hardware-in-the-loop (HIL) card and Applied’s simulation software.
Micron Appoints Mark Montierth as Corporate Vice President and General Manager of Mobile Business Unit
Micron Technology, Inc. today announced the appointment of Mark Montierth to the role of corporate vice president and general manager of its Mobile Business Unit.
A Greener Internet of Things with No Wires Attached
Emerging forms of thin-film device technologies that rely on alternative semiconductor materials, such as printable organics, nanocarbon allotropes and metal oxides, could contribute to a more economically and environmentally sustainable internet of things (IoT), a KAUST-led international team suggests.
Electronics Value Chain is Still in Transition, and Uncertainty Continues to Cloud the Market Outlook
In an increasingly volatile world, the power of intelligence helps companies increase resiliency.
NIST and AIM Photonics Team Up on High Frequency Optical/Electronic Chips
Collaborative effort will enable new chip designs for high-speed communications.
Power Integrations Names Nancy Gioia to Its Board of Directors
Power Integrations today announced that Nancy L. Gioia will join the company’s board of directors on January 1, 2023.
Novel Near-Infrared Light Detection Method Using Upconversion Materials is Demonstrated
Under the JST Strategic Basic Research Program PRESTO, Associate Professor Ayumi Ishii of Teikyo University of Science with her team members has developed a new near-infrared light sensor by using a material that converts weak near-infrared light to visible light.
Akoustis Completes Qualification of First Wafer-Level-Packages for 5G Mobile & Other Markets
Akoustis Technologies, Inc. announced today that it has completed qualification and released its internally developed proprietary wafer-level-packaging (WLP) technology for the 5G mobile, Wi-Fi, timing control, and other markets.
Gigaphoton Expands Training Capability to Enhance Its Field Services
Supporting increasing semiconductor lithography lightsources worldwide.
