Keysight Technologies, Inc., a technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced the company has received a 2021 Supplier Excellence Award from Texas Instruments (TI), as part of its annual supplier awards program and their highest level of supplier recognition.
Semiconductors
New eBook from ROHM Semiconductor and Mouser Explores Efficient Power Conversion in IIoT
Mouser Electronics, Inc. in collaboration with ROHM Semiconductor announces a new eBook that focuses on efficient components and technologies for use in low-power solutions for industrial Internet of Things (IoT) applications.
IEEE International Electron Devices Meeting (IEDM) Announces 2022 Call for Papers
Under the theme, “The 75th anniversary of the Transistor and the Next Transformative Devices to Address Global Challenges,” the 68th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
Applied Materials’ New Ioniq PVD System Solves Wiring Resistance Challenges of 2D Scaling
Applied Materials, Inc. today introduced a new system that re-engineers the deposition of transistor wiring to significantly reduce electrical resistance, which has become a critical bottleneck to further improvements in chip performance and power.
Beyond Semiconductor Packaging Materials: Advanced Silicone Solutions
Advanced silicones are enabling semiconductor manufacturers to address a variety of challenges.
Gov. Whitmer Announces New Semiconductor Career and Apprenticeship Network Program Aimed at Creating Good-Paying Jobs
Today, Governor Gretchen Whitmer joined the Michigan Economic Development Corporation to announce Michigan Strategic Fund (MSF) approval of support for a new semiconductor technician apprenticeship program intended to strengthen the pipeline of the semiconductor workforce.
EV Group Lithography Solutions for Heterogenous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2022
EV Group (EVG) announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced lithography solutions will be highlighted in several papers being presented at the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), to be held May 31-June 3 in San Diego, Calif.
Samsung Electronics and Red Hat Announce Collaboration in the Field of Next-Generation Memory Software
Samsung Electronics Co., Ltd. and Red Hat, Inc. today announced a broad collaboration on software technologies for next-generation memory solutions.
Argonne Scientists Use Quantum Computers to Simulate Quantum Materials
Scientists achieve important milestone in making quantum computing more effective.
Diamondx Selected for Internet of Things Semiconductor Test
Cohu, Inc. today announced a U.S. semiconductor manufacturer has selected the Diamondxplatform for testing their product portfolio.
