Committee aims to reconcile differences between the Senate’s United States Innovation and Competition Act (USICA) and the House’s America COMPETES Act.
Semiconductors
Moov Announces Real-Time Logistics Tracking via Moov Portal, a Full-service Digital Marketplace for Buying Used Semiconductor Equipment
Moov, a data-fueled marketplace for used semiconductor manufacturing equipment, today announced its marketplace now serves as a one-stop shop for the second-hand buying experience.
Tignis Announces $7.2 Million in Series A Funding
Tignis today announced the completion of $7.2 million in Series A Funding led by early-stage venture capital fund DN Capital with participation by Silicon Valley venture capital firm Clear Ventures.
Dover To Acquire Manufacturer Of Flow-Measurement Devices For Biopharma And Semiconductor Production Applications
Malema will become part of the PSG business unit within Dover’s Pumps & Process Solutions segment.
Tachyum Delivers the Highest AI and HPC Performance with the Launch of the World’s First Universal Processor
Tachyum today launched the world’s first universal processor, Prodigy, which unifies the functionality of a CPU, GPU and TPU in a single processor, creating a homogeneous architecture, while delivering massive performance improvements at a cost many times less than competing products.
UPVfab Adds Micro-Transfer Printing Technology for Hybrid Photonic Integration
Massively parallel pick-and-place of large arrays of III-V semiconductors bring new heterogeneous integration capabilities for silicon photonics.
Porotech Announces Strategic Partnership with IQE
Porotech announced announce a strategic partnership with IQE plc, a supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry.
Micron Announces New Greenhouse Gas Reduction Targets and Commits to Net-Zero Emissions From Its Operations by 2050
Micron Technology, Inc. today announced new targets to reduce greenhouse gas emissions as part of the company’s overall sustainability strategy outlined in its annual sustainability report.
Semiconductor Materials at a Critical Tipping Point
TECHCET, the electronic materials advisory firm providing business and technology information, held its highly successful and well-attended 2022 Critical Materials Conference in Chandler, Arizona on April 28th and 29th.
ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems
10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications.
