Intel has fallen behind in its ability to make commercially ready, leading-edge chips in sufficient volumes, opening the door to its main rivals, AMD and Nvidia, says GlobalData, a leading data and analytics company.
Semiconductors
Plasma-Therm Announces Strategic Ion Beam Development and Licensing Agreement
Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor industry, has signed a landmark agreement with one of the world’s largest semiconductor equipment companies for Ion Beam Etch technology development and equipment.
Teledyne Aerospace & Defense Electronics UK Launches New Business Unit: Teledyne Energetics UK
Today, Teledyne Aerospace & Defense Electronics UK (TADE UK) announced the latest business unit addition to its brand portfolio, Teledyne Energetics UK, headquartered in Lincoln, England.
ClassOne’s Solstice Plating System Selected for Advanced MicroLEDs
Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice GoldPro electroplating system to one of the industry’s leading developers of microLED technology for advanced applications.
Strategic Materials Conference 2020 Goes Virtual to Highlight Materials on Cutting Edge of Technology Innovation
With advanced materials a critical enabler of semiconductor growth applications, the stage is set for Strategic Materials Conference (SMC 2020), the premier event offering the latest market insights into drivers of advanced materials in the microelectronics supply chain.
pSemi Expands Portfolio with Two High-Performance Digital Step Attenuators
pSemi Corporation, a Murata company focused on semiconductor integration, announces the expansion of its digital step attenuator (DSA) portfolio with two new high-performance DSAs, PE43610 and PE43614.
Tachyum Shows Prodigy Running Existing x86, ARM, and RISC-V Software
Tachyum Inc. today announced that its Prodigy Universal Processor has successfully completed software emulation testing across x86, ARM and RISC-V binary environments.
Lam Research and VELO3D Strike Strategic Agreement to Use Metal Additive Manufacturing Applications for Production of Semiconductor Capital Equipment
Digital manufacturing innovator VELO3D and Lam Research Corporation(Nasdaq: LRCX) today announced a joint development agreement that includes collaboration on novel materials and designs in metal additive manufacturing (AM) or 3D printing applications for the semiconductor industry. Lam plans to significantly increase the volume of parts produced by AM over the next five years.
Sale of ZEISS iTrap
Atlas Copco Group, a Sweden-based provider of industrial productivity solutions has acquired iTrap mass spectrometry technology from ZEISS. The business will become part of the Semiconductor Chamber Solutions Division in Atlas Copco‘s Business Area Vacuum Technique.
Onto Innovation Announces Multiple Orders for JetStep Panel Lithography System
Onto Innovation Inc. today announced it has received multiple purchase orders for its JetStep projection lithography stepper from three leading manufacturers.
