The ability to turn on and off a physical process with just one photon is a fundamental building block for quantum photonic technologies. Realizing this in a chip-scale architecture is important for scalability, which amplifies a breakthrough by City College of New York researchers led by physicist Vinod Menon.
Semiconductors
Silicon Chip Will Drive Next Generation Communications
A new design of ultra-small silicon chip called a multiplexer will effectively manage terahertz waves which are key to the next generation of communications: 6G and beyond.
FormFactor, Inc. Reports 2021 First Quarter Results
FormFactor, Inc. today announced its financial results for the first quarter of fiscal 2021 ended March 27, 2021.
Fabless Suppliers Held a Record 33% of the 2020 IC Market
Fabless IC suppliers registered a strong 24% surge in sales last year as compared to only an 8% increase by the IDMs.
A Path to Graphene Topological Qubits
Researchers demonstrate that magnetism and superconductivity can coexist in graphene, opening a pathway towards graphene-based topological qubits.
Hprobe Receives Order from a Tier-1 Semiconductor Manufacturer for a Wafer-Level Magnetic Tester
Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a significant order from a tier-1 semiconductor manufacturer for a wafer-level magnetic tester.
Silicon Integration Initiative Targets New Silicon Carbide Standard SPICE Model
The Si2 Compact Model Coalition has voted to fund and standardize a SPICE model for silicon carbide-based metal-on-silicon field-effect transistors.
MACOM Introduces New Semiconductor Process For High Voltage Capacitors
MACOM Technology Solutions Inc. announced that it has completed the development of a new high voltage capacitor semiconductor process.
ASM AMICRA Unveils Systems Incorporating X-Celeprint’s MTP Technology for High Volume Heterogeneous Integration of Ultra-thin Chips
ASM AMICRA Microtechnologies GmbH announced three new manufacturing systems that combine X-Celeprint’s Micro-Transfer Printing (MTP) and ASM AMICRA’s high precision die bonding technology to introduce the semiconductor industry’s first complete system to enable high volume heterogeneous integration of ultra-thin dies onto up to 300mm base wafers.
FormFactor Ranked as #1 Supplier of Semiconductor Probe Cards
FormFactor, Inc. was again ranked as the world’s number one supplier of semiconductor probe cards by market research firm VLSIresearch, after growing 18% in 2020.
