Henkel Corporation today announced the commercial availability of LOCTITE ECCOBOND LCM 1000AF, a breakthrough encapsulation material that leverages a unique anhydride-free resin platform to enable thorough protection, improved warpage control and fine gap filling for fan-in and fan-out wafer-level packages (FI WLPs, FO WLPs).
Semiconductors
Hprobe Announces First Automated Test Equipment Dedicated to 3D Magnetic Sensors for Automotive and Industrial Applications
Hprobe, a provider of semiconductor Automated Test Equipment (ATE) for magnetic devices, today announced the first industry turnkey testing equipment dedicated to 3D magnetic sensors used in both automotive and industrial applications.
Silicon Labs Promotes Serena Townsend to Senior Vice President and Chief People Officer
Silicon Labs announced Serena Townsend, formerly vice president of Human Resources, has been promoted to senior vice president and chief people officer.
Metal Wires of Carbon Complete Toolbox for Carbon-Based Computers
Transistors based on carbon rather than silicon could potentially boost computers’ speed and cut their power consumption more than a thousandfold — think of a mobile phone that holds its charge for months — but the set of tools needed to build working carbon circuits has remained incomplete until now.
Fab Models Built on AI Collaborative Knowledge Sharing
New AI knowledge sharing fab models will play a leading role in shaping the fab of the future.
GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities
GLOBALFOUNDRIES announced at its annual Global Technology Conference (GTC) a significantly enhanced design for manufacturability (DFM) kit embedded with advanced machine learning (ML) capabilities.
Renesas Joins the Global Semiconductor Alliance
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced it has joined the Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry.
Graycliff Announces Semiconductor Executive and Entrepreneur Dan Rubin as Operating Advisor
Graycliff Partners LP today announced the addition of Daniel Rubin, an experienced operator and investor in the semiconductor equipment industry, as an Operating Advisor. In this role, Mr. Rubin will assist in sourcing and evaluating new opportunities and advise Graycliff’s portfolio companies within its dedicated equity strategy, focusing on the $60+ billion global semiconductor and display manufacturing industry.
Lam Research Introduces Advanced Dielectric Gapfill Technology to Enable Next-Generation Devices
Lam Research Corp. announced the advanced Striker FE platform, a new processing solution for manufacturing high-aspect-ratio chip architectures.
Reno Sub-Systems Solidifies Electronic Match Market with Nine New Patents
Reno Sub-Systems (Reno), a developer of high performance radio frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, today announced that it has been awarded nine new patents for its solid-state RF matching network technology.
