Purdue University and TSMC jointly announced plans Wednesday (June 12) to establish a Center for Secured Microelectronics Ecosystem aimed at ensuring a secure supply of semiconductor chips and related tools all the way from the foundry to the packaged system. The center, to be located at the Purdue University West Lafayette, Indiana campus, will perform research to ensure a secure ecosystem for the manufacture of microelectronics systems.
Semiconductors
Ultra-Low Power Chips Help Make Small Robots More Capable
An ultra-low power hybrid chip inspired by the brain could help give palm-sized robots the ability to collaborate and learn from their experiences. Combined with new generations of low-power motors and sensors, the new ASIC could help intelligent swarm robots operate for hours instead of minutes.
GLOBALFOUNDRIES and Soitec Announce Multiple Long-term SOI Wafer Supply Agreements
GLOBALFOUNDRIES (GF) and Soitec announced that they have signed multiple long-term supply agreements for 300mm…
Small Currents For Big Gains In Spintronics
UTokyo researchers have created an electronic component that demonstrates functions and abilities important to future generations of computational logic and memory devices.
Imec Demonstrates Optimized Process Flows For High Performance Ge-Based Devices
Today, at the 2019 Symposia on VLSI Technology and Circuits (June 9-14, 2019), imec, a…
Antennas Of Flexible Nanotube Films An Alternative For Electronics
Rice University lab claims a viable competitor for copper in 5G wireless and other applications.
Researchers ‘Stretch’ The Ability of 2D Materials To Change Technology
University of Rochester researchers have combined 2D materials with oxide materials in a new way, using a transistor-scale device platform, to fully explore the capabilities of these changeable 2D materials to transform electronics, optics, computing and a host of other technologies.
Global Fab Equipment Spending to Rebound in 2020 with 20% Growth
Global fab equipment spending will rebound in 2020, growing 20 percent to US$58.4 billion after dropping 19 percent to US$48.4 billion in 2019, according to the Q2 2019 World Fab Forecast update published by SEMI.
EVG Brings Nanoimprint Lithography to Full-Scale Production
HERCULES NIL 300 mm is a fully modular platform incorporating EVG’s SmartNIL technology to support AR/VR, 3D sensor, photonic and biotechnology production applications
Brewer Science Expands Printed Electronics Service Capabilities for Growing Market
Brewer Science, Inc. (BSI) today announced the expansion of its printed electronics program to incorporate…
