Key growth areas include high-k metal and dielectric precursors for emerging transistor architectures and advanced packaging.
Semiconductors
Ansys Thermal and Multiphysics Solutions Certified for Intel 18A Process and 3D-IC Designs
Ansys today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology.
Promex Industries Expands Capabilities, Installing Laser Depaneling and Advanced SPI Systems on Manufacturing Line
Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced it has expanded its manufacturing line, adding two advanced systems designed to support the industry’s most demanding microelectronics applications.
Natcast Announces Inaugural NSTC Technical Advisory Board
Leading experts spanning the U.S. semiconductor ecosystem will provide strategic guidance and expertise to help shape NSTC Research Agenda, advance U.S.-led innovation and economic and national security.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
SEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany.
Forge Nano Secures $40M to Scale U.S. Battery Manufacturing and Commercial Semiconductor Equipment Businesses
Forge Nano, Inc. today announced the successful close of $40 million in new funding.
Aidentyx Unveils Chip Industry’s First Manufacturing AI Framework
The path to continuous improvement for semiconductor manufacturers got a lot easier today with the announcement by Aidentyx, Inc. that it has rolled out the chip industry’s first Manufacturing AI framework featuring multiple applications, each backed by specialized AI engineering agents orchestrating smart, secure, and net-zero-friendly AI analytics that promote greater interoperability, collaboration, and increased performance among applications and data sources.
Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation, today announced that it has joined Intel Foundry Accelerator Ecosystem Alliance Program, as a member of both the IP Alliance and the recently announced Chiplet Alliance.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
