Toshiba America Business Solutions is elevating its vice president of sales operations and Toshiba Business Solutions Latin America Jim Hawkins to the role of chief operating officer.
Semiconductors
Tokyo Electron and IBM Renew Collaboration for Advanced Semiconductor Technology
Today, IBM and Tokyo Electron (TEL) announced an extension of their agreement for the joint research and development of advanced semiconductor technologies.
lowRISC and SCI Semiconductor Release Sunburst Chip Repository for Secure Microcontroller Development
Open source release accelerates path to market for commercial CHERIoT-based secure microcontrollers, supporting industry adoption and innovation.
Natcast Announces Dr. Craig Child as Director of the CHIPS for America EUV Accelerator
Industry veteran will lead Natcast on-site staff and enable NSTC Members and Natcast researchers to leverage state-of-the-art EUV technology in advancing innovation and U.S. economic and national security.
UMC Unveils New Fab Expansion in Singapore in Grand Opening Ceremony
New 22nm fab to be one of the most advanced semiconductor manufacturing facilities in Singapore and is set to create approximately 700 new jobs.
Completion of New Production Facility for Semiconductor Manufacturing Equipment in Kasado Area
Hitachi High-Tech Corporation announced that the new production facility for semiconductor manufacturing equipment was completed and started the operation on March 17, 2025.
NEDO Approves Rapidus’ FY2025 Plan and Budget for 2nm Semiconductor Projects
Rapidus Corporation today announced that its plans and budget for fiscal year 2025 have been approved by Japan’s New Energy and Industrial Technology Development Organization (NEDO).
Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics
This system is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications.
HieFo Introduces High Efficiency CW Lasers for Silicon Photonics Transceivers
HieFo announced today the product launch of multiple new high-efficiency Continuous Wave DFB indium phosphide (InP) lasers, designed to address the ever-increasing demands of silicon photonics based optical transceivers.
NHanced Semiconductors President Robert Patti to Detail “Foundry 2.0” at SEMIEXPO Heartland
New manufacturing model extends Moore’s Law via advanced packaging, employing a range of 3D IC processes.
