Samsung Electro-Mechanics today announced a collaboration with AMD to supply high-performance substrates for hyperscale data center compute applications
Semiconductors
Entegris Joined by White House Representatives and Colorado Governor to Celebrate $75 Million CHIPS Act Funding Announcement
Event in Colorado Springs highlighted the importance of building a strong U.S. semiconductor manufacturing infrastructure to support future industry growth.
PDF Solutions’ Brian Rubow Awarded the SEMI International Standards Excellence Award at SEMICON West 2024
PDF Solutions, Inc., a provider of comprehensive data solutions for the semiconductor and electronics ecosystems, is proud to announce that Brian Rubow, Director of Solutions Engineering, Cimetrix Products, PDF Solutions, has won the SEMI International Standards Excellence Award at SEMICON West 2024.
Lam Research Appoints Ava Harter as Chief Legal Officer
Lam Research Corp. today announced that Ava Harter has joined its executive leadership team as senior vice president and chief legal officer.
Nearfield Instruments Secures €135 Million in Landmark Deep-tech Funding Round
Nearfield Instruments, the developer of Metrology & Inspection (M&I) solutions for the semiconductor manufacturing industry, today announced the successful closure of a €135 million Series-C funding round.
Samco Inc. Announces Sale of Advanced Etching Systems to III-V Lab in Europe
Samco Inc., a manufacturer of semiconductor processing equipment, announced the sale of two of its advanced ICP-RIE systems, RIE-400iP, to III-V Lab, a prominent industrial research lab based in France.
JST Wins New Order for 300mm Ospray Multi-Chamber Single-Wafer Wet Processing System
Highly flexible platform delivers unprecedented flexibility, precision, and repeatability during the etching and deposition process.
onsemi Accelerates Silicon Carbide Innovation to Power the Transition to Electrification
In the face of escalating climate crises and a dramatic rise in global energy demands, governments and industries are committing to ambitious climate goals aimed at mitigating environmental impact and securing a sustainable future.
UT’s Texas Institute for Electronics Awarded $840M To Build a DOD Microelectronics Manufacturing Center
Seeking to ensure America’s national security and global military leadership, the Defense Advanced Research Project Agency (DARPA) has selected the Texas Institute for Electronics (TIE) at The University of Texas at Austin to develop the next generation of high-performing semiconductor microsystems for the Department of Defense.
Carrie Esko Joins SIA Team
The Semiconductor Industry Association (SIA) today announced Carrie Esko has joined the SIA team. Esko will serve as director of global policy for trade and supply chain matters.
