Teradyne, a supplier of automated test solutions, today launched Teradyne Archimedes analytics solution, an open architecture that brings real-time analytics to semiconductor test, optimizing test flow and yield, and lowering costs—while reducing the security risks present with cloud-based solutions.
Semiconductors
Arizona State University and Applied Materials to Create “Materials-to-Fab” Center
More than $270 million in corporate and state investment will help advance Arizona’s semiconductor industry.
Global Semiconductor Equipment Sales Forecast: $87 Billion in 2023 With 2024 Rebound, SEMI Reports
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers next year are forecast to bounce back from a projected contraction of 18.6% to $87.4 billion in 2023 following the industry record of $107.4 billion in 2022.
Nearfield Instruments’ AUDIRA is the Semiconductor Industry’s First Non-Destructive, In-Line Subsurface Metrology System
Nearfield Instruments B.V. today launched AUDIRA – the industry’s first and only in-line, non-destructive subsurface metrology system for advanced semiconductor manufacturing.
Spirit Electronics to Provide Device Analysis with Acquisition of Insight Analytical Labs
Spirit Electronics has acquired Insight Analytical Labs to add device analysis services, including destructive physical analysis (DPA), to its existing full-turnkey semiconductor supply chain services.
Westerwood Global to Rebrand as WGNSTAR Following Acquisition of NSTAR
Westerwood Global today announced its transformation and rebranding as WGNSTAR, following the acquisition of NSTAR Global Services (NSTAR), a renowned leader in facility and equipment services and workforce management.
SEMI and Semiconductor Digest Announce 2023 Best of West Award Finalists
SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2023, July 11-13 at the Moscone Center in San Francisco.
SEMICON West 2023 Opens Tomorrow to Showcase Industry Growth to $1 Trillion, Sustainability and Talent
Concurrent with SEMICON West, FLEX Conference 2023 to Spotlight Flexible Hybrid Electronics Innovations.
Applied Materials Advances Heterogeneous Chip Integration with New Technologies for Hybrid Bonding and Through-Silicon Vias
Applied Materials, Inc. today introduced materials, technologies and systems that help chipmakers integrate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs). The new solutions extend Applied’s industry-leading breadth of technologies for heterogeneous integration (HI).
What’s in the July Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the July issue. Pick up your copy in print at SEMICON West in the publication bins and at the Semiconductor Digest Booth 1829.
