SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the provisional agreement reached yesterday in the European Chips Act Trilogue Negotiations to invest €43 billion to bolster Europe’s microelectronics industry.
ROHM Introduces the Industry’s Smallest Class of Short-Wavelength Infrared Devices
ROHM Semiconductor today announced mass production technology for Short-Wavelength Infrared (SWIR) devices in the industry’s smallest class 1608-size (1.6mm × >0.8mm) for portable / wearable / hearable devices requiring material detection.
Creation of Thinnest Freestanding Film With Ferroelectric Properties Ever Opens the Door to Smaller, More Efficient Devices
Researchers at the Institute for Future Materials and Systems at Nagoya University in Japan have successfully synthesized barium titanate (BaTiO3) nanosheets with a thickness of 1.8 nanometers, the thinnest thickness ever created for a free-standing film.
Marvell Demonstrates Industry’s First 3nm Data Infrastructure Silicon
Marvell Technology, Inc. has demonstrated high-speed, ultra-high bandwidth silicon interconnects produced on Taiwan Semiconductor Manufacturing Company’s (TSMC) 3-nanometer (3nm) process.
SK hynix Develops Industry’s First 12-Layer HBM3
SK hynix Inc. announced today it has become the industry’s first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in the industry, and said customers’ performance evaluation of samples is underway.
SkyWater President and CEO Thomas Sonderman to Deliver Keynote at 2023 ASMC
Keynote to highlight impact of CHIPS Act on semiconductor manufacturing sector and importance of secure sources for critical emerging technology innovations.
STMicroelectronics Publishes 2023 Sustainability Report
STMicroelectronics today releases its annual sustainability report detailing 2022 performance, strategy, and ongoing action plans.
Monozukuri Cracks the Code to IC/Package Co-optimization
Anna Fontanelli, Monozukuri S.p.A. CEO and Founder, demonstrated MZ-GENIO, the first integrated IC/Packaging EDA tool, during the “Advanced 3D architecture and design methodology” session at DATE on Wednesday in Antwerp, Belgium.
Quantum Source Raises $12M to Propel Continued Development in Photonic Quantum Computing
The extension brings Quantum Source’s seed round total to $27M, one of the largest total seed financings in the field of Quantum Computing.
Take a Look Inside a Vacuum Gauge: Pfeiffer Vacuum Publishes Easy-to-Understand Videos
To assist in choosing the right measurement principle, Pfeiffer Vacuum has made helpful explanatory videos that give a detailed insight into the inner workings and functionality of vacuum gauges.
