Semiconductor Research Corporation (SRC), a world-renowned semiconductor research and workforce development consortium, released an interim report for the Microelectronic and Advanced Packaging Technologies (MAPT) Roadmap.
proteanTecs to Host Industry Experts for Panel Discussion on the Data Revolution of Semiconductor Production
The webinar features industry experts from Qualcomm, Microsoft Azure and Advantest and will be held on Tuesday, March 7 at 9 am PST/12 pm EST/6 pm CET.
StratEdge to Display Molded Ceramic Semiconductor Packages at the IMAPS Device Packaging, APEC, and GOMACTech Conferences
StratEdge Corporation will display its molded ceramic packages at the IMAPS Device Packaging, APEC, and GOMACTech conferences, all of which are being held in March.
Magnachip Unveils Super-Short Channel MXT MOSFETs for Smartphone Battery Protection Circuit Modules
Magnachip Semiconductor Corporation announced today that the company has released two seventh-generation MXT MOSFETs.
IDTechEx Discusses Emerging Applications for Silicon Photonics
In the report “Semiconductor Photonic Integrated Circuits 2023-2033”, IDTechEx takes a close look at photonic chip-scale systems.
EUV Tech Raises Series A Funding
Capital to accelerate EUV Tech product roadmap in support of leading-edge semiconductor lithography.
Scintil Photonics Demonstrates First Single Chip 100 GHz DFB Comb Laser Source at OFC 2023
Named SCINTIL Comb Laser Source, this is the first fully integrated single chip that achieves 100-GHz frequency spacing, which is half to one-quarter of the spacing available today.
Accellera Systems Initiative Posthumously Honors Phil Moorby with 2023 Technical Excellence Award
Mr. Moorby honored during DVCon U.S. 2023 for inventing Verilog HDL.
TUS Researchers Propose a Simple, Inexpensive Approach to Fabricating Carbon Nanotube Wiring on Plastic Films
The proposed method produces wiring suitable for developing all-carbon devices, including flexible sensors and energy conversion and storage devices.
JCET Provides Multiple Customers with Advanced Packaging HVM Solutions for 4D Millimeter-wave Radar
JCET Group recently announced the company provides multiple customers with advanced packaging HVM solutions for 4D millimeter-wave Radar, to meet the increasingly diversified and customized demands of automotive electronic applications.
