Magnachip Introduces 8th-Gen 150V MXT MOSFET for Light Electric Vehicles

Magnachip Semiconductor Corporation announced today that the company has launched its eighth-generation 150V MXT Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) optimized for Light Electric Vehicle (LEV) motor controllers and battery management systems (BMSs).

A Greener Internet of Things with No Wires Attached

Emerging forms of thin-film device technologies that rely on alternative semiconductor materials, such as printable organics, nanocarbon allotropes and metal oxides, could contribute to a more economically and environmentally sustainable internet of things (IoT), a KAUST-led international team suggests.

Akoustis Receives First 5G Mobile BAW Filter Design Win from Tier-1 RF Component Company

The filter solution leverages one of Akoustis’ new wafer-level-packages (WLP), developed and manufactured its Canandaigua, New York fab

Electronics Value Chain is Still in Transition, and Uncertainty Continues to Cloud the Market Outlook

In an increasingly volatile world, the power of intelligence helps companies increase resiliency.

Wafer-Thin Device Has Potential to Transform the Field of Islet Cell Transplantation

Implantable platform provides prolonged treatment of Type 1 diabetes.

NIST and AIM Photonics Team Up on High Frequency Optical/Electronic Chips

Collaborative effort will enable new chip designs for high-speed communications.

Pixelworks and the HONOR 80 GT Unlock the Full Potential of Visual Display Optimization

Pixelworks, Inc., a provider of video and display processing solutions, today announced that the latest HONOR 80 GT smartphone incorporates Pixelworks’ advanced X5 Plus visual processor.

Hisense Advances the Laser Display Field with Texas Instruments DLP Technology

At the Global Partner Conference on 18th December, Hisense introduced a new 8K laser display technology enabled by DLP technology from Texas Instruments (TI)

100-fold Current Density Enhancement Puts imec’s Nanomesh electrodes in Pole Position for High-Throughput Electrochemical Applications

Imec, together with its partner KU Leuven in EnergyVille, today announces an important proof point towards implementation of nanomesh structures in high-throughput industrial processes for energy-related applications such as electrolysers, fuel cells and batteries.

Power Integrations Names Nancy Gioia to Its Board of Directors

Power Integrations today announced that Nancy L. Gioia will join the company’s board of directors on January 1, 2023.