Following the news that TSMC reported strong Q3 2022 results; Josep Bori, Thematic Research Director at GlobalData, offers his view.
Achronix Appoints Mahesh Karanth as CFO
Achronix Semiconductor Corporation announced it has named semiconductor industry veteran, Mahesh Karanth, as its chief financial officer.
Advanced Semiconductor Packaging Technologies in Data Centers: The Growth Drivers and the Cutting-Edge Use Cases
Growth drivers of advanced semiconductor packaging technologies on data center applications, as well as give several examples of cutting-edge commercial server products that adopt advanced semiconductor packaging technologies.
U.S. Government to Fund Expansion of IP Ecosystem for SkyWater’s 90nm Rad-Hard Platform
SkyWater Technology today announced the Department of Defense (DOD) is investing $12 million to expand the intellectual property (IP) ecosystem for the company’s 90nm radiation-hardened (rad-hard) by process offering, as part of the previously announced $27 million investment.
Research University Selects Veeco’s New Integrated Molecular Beam Epitaxy and Atomic Layer Deposition System
Veeco Instruments Inc. announced today that it has received an order from Justus Liebig University Giessen (University of Giessen) for an integrated GENxplor R&D Molecular Beam Epitaxy (MBE) and Fiji Atomic Layer Deposition (ALD) system.
What’s in the October Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the October issue. If you are attending SEMICON Europa stop by the publication bins and pick up a copy in print!
Lockheed Martin, Ayar Labs Partner to Advance Microchip Connectivity for Next Generation Sensory Systems
Lockheed Martin, (NYSE: LMT) and Ayar Labstoday announced a strategic collaboration to develop future sensory platforms that leverage Ayar Labs’ advanced optical I/O microchips that use light to transfer data faster, at a lower latency, and at a fraction of the power of existing electrical I/O solutions.
Graphene Boosts Flexible and Wearable Electronics
New Caltech research demonstrates how the honeycombed material can enhance electronics.
Samco Unveils Plasma Enhanced ALD System for SiC and GaN Power Devices
Samco launches the new Plasma Enhanced Atomic Layer Deposition (PEALD) system, “AD-800LP”.
New Cadence Certus Delivers Up to 10X Faster Concurrent Full-Chip Optimization and Signoff
Cadence Design Systems, Inc. today announced the new Cadence Certus Closure Solution to address growing chip-level design size and complexity challenges.
