Newsight Imaging Ltd., an innovative semiconductor company that develops 3D machine vision sensors and spectral vision chips, today announced it has joined NVIDIA Inception, a program designed to nurture startups revolutionizing industries with technology advancements.
A Time of Transition: Supplyframe Commodity IQ Indicates Shortening Lead Times, Stabilizing Prices, and Lower Demand for Select Electronic Components
But overall demand remains strong and global supply chain issues will persist into H1 2023.
Advanced Semiconductor Packaging Paves Way to Data-Centric Future, Says IDTechEx
IC vendors have been pushed towards “advanced semiconductor packaging” to meet the world’s data needs.
On the Way to Quantum Sensors
The new research project IQ-Sense – Integrated Spin Systems for Quantum Sensors aims to measure physical quantities such as temperature, pressure, magnetic or electric fields with unprecedented precision.
Mercury Systems Receives $12M Order for Advanced Packaging of GPS Modules
Mercury Systems Inc. announced it received a $12 million order from a leading defense prime contractor to provide advanced trusted and secure manufacturing and packaging for their GPS modules.
US CHIPS ACT Now Approved by President Biden – What’s Next?
Yesterday, President Biden signed the long-awaited CHIPs Act into law. So, “what’s next” for the US semiconductor industry? The electronic materials advisory firm TECHCET offers insight.
President Biden Signs CHIPS Act Into Law
The legislation provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs.
Akoustis Ships Second 5G Mobile Filter Design in its New Wafer-Level-Package to First Foundry Customer
Akoustis Technologies, Inc., an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today that it has completed the second design iteration of a 5G mobile filter and shipped samples to its first XBAW mobile foundry customer.
Henkel and CITC Forge Partnership to Accelerate High-Thermal Die Attach Solutions
Henkel and Chip Integration Technology Center (CITC) announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die attach solutions for radio frequency (RF) and power electronics.
Gwangju Institute of Science and Technology Scientists Improve the Power Output of Triboelectric Nanogenerators with Carbon Particles
Mesoporous carbon spheres facilitate charge transport and high surface charge densities in triboelectric nanogenerators for a 1300-fold higher output current.
