Toshiba has launched a 150V N-channel power MOSFET “TPH9R00CQH” that uses the latest-generation process, “U-MOSX-H,” and that is suitable for use in switching power supplies for industrial equipment.
Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development
Faraday Technology Corporation, ASIC design service and IP provider, today launched SoCreative!VI A600 SoC development platform implemented in Samsung Foundry’s 14LPP FinFET process technology.
Intel to Acquire Granulate
Intel Corporation today announced an agreement to acquire Granulate Cloud Solutions Ltd., an Israel-based developer of real-time continuous optimization software.
indie Semiconductor Announces Retirement of Bill Woodward and Appointment of Diane Biagianti to Its Board of Directors
indie Semiconductor, an Autotech solutions innovator, today announced that Bill Woodward has retired and Diane Biagianti has been appointed to its board of directors.
Samsung and Western Digital Begin Far-reaching Collaboration
Companies to first lead standardization of Zoned Storage technology; Cooperative efforts include developing and promoting hardware specifications and software application models to build a robust ecosystem.
Cognifiber Downsizes its System for Edge Computing With Breakthrough Glass Processors
Cognifiber, a deep technology company focusing on revolutionizing photonic computing, announced the development of a glass-based photonic chip that will bring its technology one step closer to revolutionizing edge computing.
Fujifilm Completes $88 Million Expansion of its Facility in Mesa, Arizona to Supply the Semiconductor Industry
Expansion increases manufacturing capacity, R&D facilities, and analytical and metrology equipment expertise in support of new product development. Plans to add 120 new positions over the next two years to support growth.
Semiconductor Time-To-Market Enhanced with Circuit Edit Solutions
New devices will require advanced FIB circuit edit capabilities that empower operation in smaller, higher density areas.
Scientists Achieve Record Efficiency for Ultra-Thin Solar Panels
A team co-led team by the University of Surrey has successfully increased the levels of energy absorbed by wafer-thin photovoltaic panels by 25%.
New Program Bolsters Innovation in Next-Generation Artificial Intelligence Hardware
The MIT AI Hardware Program is a new academia and industry collaboration aimed at defining and developing translational technologies in hardware and software for the AI and quantum age.
