Breker Verification Systems used the opening of DVCon U.S. today to unveil SystemUVM, a framework designed to simplify specification model composition for test content synthesis with a UVM/SystemVerilog syntactic and semantic approach familiar to universal verification methodology (UVM) engineers.
Luminous Computing Raises $105M in Series A Round to Build World’s Most Powerful AI Supercomputer
Emerging from stealth mode, Luminous is building the supercomputer that compliments algorithms to deliver more compute, bandwidth, and memory that’s been the missing piece in addressing monumental, revolutionary problems that humans simply can’t solve.
Renesas and Fixstars to Establish Automotive SW Platform Lab to Develop Software and Operating Environments for Deep Learning
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, and Fixstars Corporation, a developer of multi-core CPU/GPU/FPGA acceleration technology, announced their intention to collaborate in the automotive deep learning field.
Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.
Silvaco Announces that Teledyne e2v Expands Adoption of its Victory TCAD Solution to Further Accelerate Development of CMOS Image Sensors
Silvaco Group, Inc., a provider of TCAD, EDA software, and Design IP, today announced that Teledyne e2v, a global leader in imaging solutions, has renewed its commitment to Silvaco’s Victory TCAD solution to accelerate its CMOS image sensor development.
STMicroelectronics Recognized as Top 100 Global Innovator 2022
STMicroelectronics has been named Top 100 Global Innovator 2022.
EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits
The collaboration will leverage EVG’s nanoimprint lithography (NIL) technology, expertise and services with Teramount’s PhotonicPlug technology.
Ferroelectric Devices Forge Ahead
At IEDM 2021 the new star of the emerging memory firmament was ferroelectric memories, either in 1T/1C (FeRAM) or 1T (FeFET) structures.
Scanning Electron Microscopy Takes the Spotlight in Annual Deep Learning Survey by the eBeam Initiative
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today published its second annual Deep Learning (DL) survey of its members’ products and applications using DL in the photomask to wafer manufacturing flow.
Energy-efficient AI Semiconductor Company EdgeCortix Closes Series A Funding
EdgeCortix the AI-focused fabless semiconductor company today announced that it has closed over $8 Million USD in series A funding
