Brooks Automation Announces Agreement To Sell Its Semiconductor Solutions Group Business To Thomas H. Lee Partners

Brooks Automation, Inc. today announced that it has entered into a definitive agreement to sell its Semiconductor Solutions Group business to Thomas H. Lee Partners for $3.0 billion in cash.

Materion to Acquire H.C. Starck’s Electronic Materials Portfolio

Materion Corporation today announced that it has entered into an agreement to acquire H.C. Starck Solutions’ industry-leading, electronic materials business, located in Newton, Massachusetts (HCS-Electronic Materials).

Work Commences to Develop the World’s Smallest Brain-Inspired Computer

Artificial intelligence (AI) has seen explosive growth in recent years, but despite major progress, the power required to run AI algorithms continues to increase.

Syntiant Introduces NDP102 Neural Decision Processor for Edge AI Sensor Applications

Syntiant Corp, a provider of deep learning solutions making edge AI a reality for always-on applications in battery-powered devices, today announced its new Syntiant NDP102 Neural Decision Processor (NDP) for sensor applications that delivers 100x improvement in efficiency and performance compared to current MCU-based offerings.  

Edwards Officially Opens New Flagship Service Technology Centre in Dublin

Edwards, a supplier of vacuum and abatement services and solutions to the global semiconductor industry, today opened its new flagship Service Technology Centre (STC) in Blanchardstown, Dublin.

Purdue University Technology for Downscaling Transistors Could Advance Semiconductor Design

An innovation by Purdue University researchers could help the semiconductor industry design transistors that are smaller, use less power and switch from on to off at smaller applied voltages.

GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products

GlobalFoundries (GF) and Qualcomm Global Trading PTE. Ltd., a subsidiary of Qualcomm Technologies, Inc., announced that they are extending their successful RF collaboration on 5G multi-Gigabit speed RF front-end products for delivering the high cellular speeds, superior coverage, and outstanding power efficiency in the sleek form factors users expect from the newest generation of 5G-enabled products.

MSEC 2021 to Highlight Leading-Edge MEMS and Sensors Innovations as IoT Spending Surges

Returning to a live format, MEMS and Sensors Executive Conference (MSEC 2021) will gather industry visionaries and experts October 11-13 at the Coronado Island Marriott Resort in San Diego for insights into the latest trends and innovations in sensorization for growth markets including medical, fitness, connected communities, environmental and air quality, and wearables.

ITRI, AITA, and UCLA CHIPS Forge Cooperation on AI Chip Development

The Department of Industrial Technology (DoIT) of the Ministry of Economic Affairs (MOEA) is supporting the commencement of cooperation between Industrial Technology Research Institute (ITRI), the AI on Chip Taiwan Alliance (AITA), and the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS).

JSR Agrees to Acquire EUV Pioneer Inpria Corporation

JSR announced today that it has signed an agreement for the acquisition of Corvallis, OR based Inpria Corporation, an innovator of metal oxide photoresist design, development and manufacturing for extreme ultraviolet (EUV) lithography, for USD $514 million.